Senior Semiconductor Packaging Engineer — Simulation

Analog Devices; Wilmington (MA); On-site; USD 113,190 - 163,905; Full time

Benefits offered by this job

Medical, vision, and dental coverage

401k

Paid vacation

Discretionary performance-based bonus

Job summary

Analog Devices in Wilmington, MA is seeking an experienced individual for the role focused on developing advanced packaging solutions for semiconductor devices. Responsibilities include leading design efforts and performing mechanical and thermal simulations while collaborating with various technical teams.

The ideal candidate will possess a PhD or Master’s in Mechanical or Electrical Engineering along with over 5 years of relevant experience in semiconductor packaging development. A thorough understanding of packaging materials and processes is essential.

This role offers competitive compensation, including medical benefits, a 401k, and opportunities for performance bonuses.

Qualifications

• 5+ years of hands-on experience in semiconductor packaging development, package simulation, or packaging manufacturing.
• Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
• Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.

Responsibilities

• Lead the design, development, and qualification of semiconductor packaging solutions.
• Perform mechanical simulations of IC packages and systems using FEM tools.
• Collaborate with OSAT partners and suppliers to improve yield.

Skills

Semiconductor packaging development

Mechanical simulations

Thermal analysis

FEM tools

Cross-functional collaboration

Education

PhD or Master’s degree in Mechanical Engineering or Electrical Engineering

Tools

ANSYS

FloTHERM

Sigrity

Icepak

Cadence Allegro

Job description

Analog Devices in Wilmington, MA is seeking an experienced individual for the role focused on developing advanced packaging solutions for semiconductor devices. Responsibilities include leading design efforts and performing mechanical and thermal simulations while collaborating with various technical teams.

The ideal candidate will possess a PhD or Master’s in Mechanical or Electrical Engineering along with over 5 years of relevant experience in semiconductor packaging development. A thorough understanding of packaging materials and processes is essential.

This role offers competitive compensation, including medical benefits, a 401k, and opportunities for performance bonuses.