Packaging Module Development Engineer

Intel; Phoenix (AZ); On-site; USD 133,800 - 255,200; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement plans

Vacation

Job summary

Intel is seeking a Mechanical Engineer for the Advanced Packaging Mechanical Analysis team in Chandler, AZ. This position focuses on developing advanced finite element analysis simulations for semiconductor packaging, requiring regular onsite presence.

The ideal candidate will possess a PhD in Mechanical Engineering and relevant experience in thermal-mechanical research and Finite Element Analysis tools. The role offers a competitive salary and benefits package, reflecting the industry’s best.

Qualifications

• PhD in Mechanical Engineering, Chemical Engineering or Material Sciences.
• 3+ years of thermal-mechanical work/research experience.
• 3+ years of experience with Finite Element Analysis tools.

Responsibilities

• Develop and validate finite element analysis models for semiconductor packages.
• Collaborate with teams to define simulation requirements and provide recommendations.
• Utilize both simulations and experiments to solve engineering problems.

Skills

Finite Element Analysis

Thermal-mechanical research

Experimental material characterization

Python

Multiphysics simulations

Education

PhD Degree in Mechanical Engineering or related field

Tools

DMA/TMA

Nano-indentation

Job description

Overview

Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you\'ll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life.

We\'re looking to hire a highly motivated mechanical engineer to join the Advanced Packaging Mechanical Analysis team located in Chandler, AZ. This role focuses on developing Multiphysics thermo-mechanical simulations to support design, definition, development and qualifications of advanced semiconductor packaging led by Intel Foundry. This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design, technology integration, reliability, yield and manufacturing.

This role requires regular onsite presence to fulfill essential job responsibilities.

Responsibilities

• Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
• Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.
• Drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs.
• Leverage both experimental and numerical methods across thermal, mechanical, and fluids domains to solve engineering problems.
• Utilize a combination of simulations and experiments as needed.
• Apply advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches.

Ideal Candidate

• Demonstrated ability to work seamlessly between experiments and simulations.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications

• PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics.
• 3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability
• 3+ years of experience with Finite Element Analysis tools
• 3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation.

Preferred Qualifications

• Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma.
• Experience with co-packaging optics, optical coupling, fiber pigtail attachment, free space optics.
• Experience with designing, planning and executing experiments, along with interpretation of results.
• Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.
• Knowledge in advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.
• Programming/script development with artificial intelligence and machine learning concepts.
• Previous related work experience in a semiconductor foundry preferred.

Job Details

• Job Type: College Grad
• Shift: Shift 1 (United States of America)
• Primary Location: US, Arizona, Phoenix

Business Group

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers. From delivering cutting-edge silicon process and packaging technology leadership for the AI era to enabling customers to design leadership products, we focus on service, technology enablement and capacity commitments across global manufacturing and packaging networks.

Benefits

We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and benefit programs covering health, retirement, and vacation. The annual salary range for jobs which could be performed in the US is $133,800.00 - 255,200.00 USD. The range reflects minimum and maximum target compensation across all US locations; individual pay is determined by location, skills, experience, and education.

Work Model

This role will require on-site presence. Job posting details (work model, location or time type) are subject to change.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.