Lead Packaging Mechanical Simulation Engineer

Samsung Semiconductor Inc.; San Jose (CA); On-site; USD 163,000 - 253,000; Full time

Job summary

Samsung Semiconductor, Inc. in the United States is seeking a highly skilled PhD-level Mechanical Engineer to perform advanced numerical modeling and simulation for cutting-edge semiconductor packages and memory devices.

You will develop and maintain scripts (Python, MATLAB) to streamline preprocessing, simulation, and analysis, and support mechanical/thermal design throughout development stages. Applicants should have deep expertise with ANSYS/Abaqus/HyperMesh, strong writing skills, and the

Qualifications

• PhD in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or closely related field.
• 3–5+ years of hands-on modeling and simulation experience in high-tech or semiconductor industry.
• Expertise with leading simulation tools (ANSYS, Abaqus, HyperMesh) and pre/post-processing software.
• Experience in static and dynamic linear/nonlinear analyses of packaging and interconnects.
• Strong technical writing and ability to communicate complex concepts clearly.

Responsibilities

• Perform advanced numerical modeling and simulation to evaluate and improve package performance and reliability.
• Provide mechanical design support throughout concept, modeling, qualification, and testing phases.
• Apply hand-on mechanical/thermal modeling of microelectronic components including BGAs and interconnects.
• Develop scripts for automation (Python, MATLAB, or ANSYS APDL) to streamline studies.
• Collaborate with cross-functional and globally distributed teams on projects.

Skills

Modeling & simulation

Technical writing

Cross-functional collaboration

Curiosity & learning

Education

PhD in Mechanical Engineering or related field

Tools

ANSYS

Abaqus

HyperMesh

Job description

Samsung Semiconductor, Inc. in the United States is seeking a highly skilled PhD-level Mechanical Engineer to perform advanced numerical modeling and simulation for cutting-edge semiconductor packages and memory devices.

You will develop and maintain scripts (Python, MATLAB) to streamline preprocessing, simulation, and analysis, and support mechanical/thermal design throughout development stages. Applicants should have deep expertise with ANSYS/Abaqus/HyperMesh, strong writing skills, and the