Module Packaging Engineer – Foundry Tech Platform

Intel Corporation; Chandler (AZ); On-site; USD 85,000 - 163,000; Full time

Job summary

Intel Corporation in the United States (Arizona, Phoenix) seeks a Module Engineer for its Foundry Technology Manufacturing unit. You will design, optimize, and validate assembly processes and equipment for next‑generation foundry packaging, working at the interface of engineering, manufacturing and technology development.

You will define DOE-based specs, drive improvements, and collaborate with suppliers to enforce process quality and reliability across packaging platforms.

Qualifications

• US Citizenship required.
• Bachelor’s degree with 1+ years in Mechanical, Materials, Chemical, Electrical Engineering or STEM field.
• Master’s degree in engineering or related STEM field.
• Associate degree with 12+ years in engineering and 6+ months SPC/DOE experience.

Responsibilities

• Design and develop assembly processes and equipment for foundry packaging.
• Optimize manufacturing efficiency while meeting quality, reliability, cost, yield and manufacturability requirements.
• Define process and equipment specs using DOE and data analysis, document innovations with white papers.
• Develop and maintain equipment to evaluate silicon and package technologies under simulated field conditions.
• Ensure manufacturability within foundry processes and oversee full cycle of packaging production.

Skills

DOE principles

Statistical methods

Process optimization

Engineering problem solving

Education

Bachelor’s degree in Mechanical/Materials/Chemical/Electrical Engineering or STEM

Master’s degree in Mechanical/Materials/Chemical/Electrical Engineering or STEM

Associate degree with 12+ years in engineering role

Job description

Intel Corporation in the United States (Arizona, Phoenix) seeks a Module Engineer for its Foundry Technology Manufacturing unit. You will design, optimize, and validate assembly processes and equipment for next‑generation foundry packaging, working at the interface of engineering, manufacturing and technology development.

You will define DOE-based specs, drive improvements, and collaborate with suppliers to enforce process quality and reliability across packaging platforms.