Module Engineer – Semiconductor Assembly & NPIs

Intel

Phoenix (AZ)

On-site

USD 99,000 - 140,000

Full time

5 days ago
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Benefits offered by this job

Stock bonuses
Health insurance
Retirement plan
Paid vacation

Job summary

Intel in the United States (Arizona, Phoenix) seeks an experienced ATTD Microelectronic Packaging Engineer to manage projects, design/develop packages, and sustain IC assemblies. You will lead DOE activities, support NPIs, and coordinate with Manufacturing on issues, ensuring data collection and process improvements on the floor.

The role emphasizes hands-on floor time, cross-functional collaboration, and ownership of quality excursions with strong documentation and teamwork.

Qualifications

  • Bachelor’s degree with 2+ years of relevant experience.
  • Master’s degree with 6+ months of relevant experience.

Responsibilities

  • Prioritize and organize daily activities around multiple requests for engineering DOEs, pre-ops meeting prep, documentation and AR tracking.
  • Be experts in all tools and processes in the area to support elaborate DOEs and NPIs.
  • Coach and role model the correct execution of module operations.
  • Clearly understand and communicate execution issues, quality excursions, and equipment problems to Engineering and Manufacturing teams.
  • Prepare and execute New Product Introductions, including evaluation of recipe needs and creation.

Skills

Technical problem solving
Cross-functional collaboration

Education

Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or related field
Master’s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or related field

Job description

Intel in the United States (Arizona, Phoenix) seeks an experienced ATTD Microelectronic Packaging Engineer to manage projects, design/develop packages, and sustain IC assemblies. You will lead DOE activities, support NPIs, and coordinate with Manufacturing on issues, ensuring data collection and process improvements on the floor.

The role emphasizes hands-on floor time, cross-functional collaboration, and ownership of quality excursions with strong documentation and teamwork.

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