Module Engineer: Foundry Packaging Innovator

Intel; Phoenix (AZ); On-site; USD 85,200 - 162,500; Full time

Job summary

Intel's Foundry Technology Manufacturing unit seeks a Module Engineer to develop and optimize assembly processes and equipment for next-generation foundry packaging. You will work at the intersection of engineering, manufacturing, and technology development to deliver world-class packaging solutions for foundry customers, collaborating with cross-functional teams across design, process, and QA.

The role emphasizes reliability, process control, and continuous improvement, with hands-on experience

Qualifications

• US Citizenship required.
• Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study.
• Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study.
• 6+ months of experience with SPC and/or DOE principles.

Responsibilities

• Design and develop assembly processes and equipment for foundry packaging.
• Optimize manufacturing efficiency meeting quality, reliability, cost, yield, and productivity targets.
• Define process and equipment specifications using DOE and data analysis; document innovations and improvements.
• Develop and maintain equipment to evaluate silicon and package technologies under thermal cycling, humidity, and dynamic stress testing.
• Ensure package designs are manufacturable within foundry process flows and oversee production processes.
• Establish material specifications for contract assemblers and raw material vendors, partnering with supplier quality and procurement to enforce standards.
• Create reliability screening techniques and acceleration methods to detect packaging risks.
• Define reliability requirements and influence design decisions, material selection and process development.
• Lead continuous improvement using statistical methods and experimental design to enhance equipment and process performance.
• Serve as technical resource for foundry packaging challenges and provide consultation on process improvements.
• Drive standardization across qualification frameworks and manufacturing quality systems, engaging with teams to mitigate risks.

Skills

DOE principles

SPC

Education

Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study

Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study

Associate degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study with 12+ years of experience in an engineering role

Job description

Intel's Foundry Technology Manufacturing unit seeks a Module Engineer to develop and optimize assembly processes and equipment for next-generation foundry packaging. You will work at the intersection of engineering, manufacturing, and technology development to deliver world-class packaging solutions for foundry customers, collaborating with cross-functional teams across design, process, and QA.

The role emphasizes reliability, process control, and continuous improvement, with hands-on experience