Packaging Quality & Reliability Engineer

Intel

Phoenix (AZ)

On-site

USD 120,860 - 170,630

Full time

14 days+

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Benefits offered by this job

Stock bonuses
Health benefits
Retirement plan
Paid time off

Job summary

Intel is seeking a Packaging Quality and Reliability Engineer to drive quality standards for packaging components across development and manufacturing. You will shape reliability models, analyze failure data, and influence decisions that ensure product readiness.

You will collaborate with internal teams and external partners to meet milestones, define metrology strategies, and drive standardization across qualifications and processes.

Qualifications

  • PhD required with semiconductor packaging exposure and failure‑mode understanding.
  • Experience with reliability and quality across packaging processes is preferred.

Responsibilities

  • Develop and maintain quality and reliability standards for packaging components, including inspection and testing mechanisms.
  • Evaluate materials, processes, and techniques to ensure compliance with requirements.
  • Define metrology strategies to capture quality parameters across packaging modules.
  • Develop equipment to evaluate silicon and packaging under simulated field conditions.
  • Analyze reliability data to identify risk areas and provide process improvement insights.
  • Develop reliability models via statistical analysis to assess risks and failure impacts.
  • Innovate acceleration techniques and quality screens for new packaging processes.
  • Drive standardization in qualification, manufacturing quality systems, and methods.
  • Collaborate with internal teams and external partners to meet milestones and reduce risks.
  • Respond to quality excursions and provide recommendations to improve reliability.

Skills

Statistical analysis
DOE principles
Reliability modeling
Python/SQL
8D problem solving
Cross-functional leadership
Package technologies (BGA, wafer-level

Education

PhD in engineering/science

Tools

Statistical tools
Analytical lab techniques

Job description

Intel is seeking a Packaging Quality and Reliability Engineer to drive quality standards for packaging components across development and manufacturing. You will shape reliability models, analyze failure data, and influence decisions that ensure product readiness.

You will collaborate with internal teams and external partners to meet milestones, define metrology strategies, and drive standardization across qualifications and processes.

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