Packaging Reliability Lab Engineer – Advanced Technologies

Intel Corporation; Phoenix (AZ); On-site; USD 133,800 - 188,890; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Job summary

Intel Corporation's Stress Testing and Reliability Laboratory seeks a hands-on Advanced Packaging Reliability Lab Engineer to advance EMIB, Foveros, Hybrid Bonding, and Co-Packaged Optics while supporting package qualification and technology development efforts.

You will work with a diverse team to operate and maintain environmental stress test systems, characterize equipment performance, and translate reliability requirements into new tools and fixtures.

Qualifications

• Master's degree in Electrical Engineering or related field with 3+ years of experience, or PhD with 0 years.
• Strong understanding of DC electrical systems and programmable DC power supplies.
• Experience with electrical measurement and data acquisition equipment including DMMs and thermocouple systems.
• Familiarity with data acquisition software and protocols (GEM 300, Ethernet, GPIB, RS-232).
• Experience with scripting/automation or software such as LabVIEW, Python, JMP, SQL.
• Ability to read electrical schematics and understand calibration practices including ISO 9001/17025 readiness.

Responsibilities

• Characterization of equipment performance and response to excursions/issues.
• Continuous improvement of methods, specifications, and training.
• Development, analysis, and implementation of statistical process control.
• Translation of reliability stress analysis into fixturing and new tools.
• Coordination of tool vendors and field service engineers.
• Collaboration with internal operations, planning, and facilities teams.

Skills

DC power systems

Electrical measurement

Data analysis

Scripting basics

Sensors & instrumentation

Education

Master's degree in Electrical Engineering

PhD in Electrical Engineering

Tools

LabVIEW

Python

JMP

SQL

GPIB

Ethernet

RS-232

Job description

Intel Corporation's Stress Testing and Reliability Laboratory seeks a hands-on Advanced Packaging Reliability Lab Engineer to advance EMIB, Foveros, Hybrid Bonding, and Co-Packaged Optics while supporting package qualification and technology development efforts.

You will work with a diverse team to operate and maintain environmental stress test systems, characterize equipment performance, and translate reliability requirements into new tools and fixtures.