Packaging Engineering Intern: Shape Next-Gen Semiconductors

Texas Instruments Incorporated; Dallas, Northern (TX, KY); Hybrid; USD 25,000 - 36,000; Part time

Benefits offered by this job

On-site internship

Job summary

Texas Instruments Incorporated invites applications for a Packaging Engineering Intern. You will work across multiple work areas and organizations to help design, develop, and analyze semiconductor packaging technologies, enabling differentiation for TI's analog and embedded processing products.

Assignments may include participation in cross-functional teams to develop solutions for Wirebond, Flip Chip, Modules, SIPs and other advanced packages at varying readiness stages, with emphasis on

Responsibilities

• Design, develop, and analyze semiconductor packaging technologies across TI's analog and embedded processing products.
• Participate in cross-functional teams to develop internal and external solutions for packaging technologies such as Wirebond, Flip Chip, Modules, SIPs and other advanced packages.

Job description

Texas Instruments Incorporated invites applications for a Packaging Engineering Intern. You will work across multiple work areas and organizations to help design, develop, and analyze semiconductor packaging technologies, enabling differentiation for TI's analog and embedded processing products.

Assignments may include participation in cross-functional teams to develop solutions for Wirebond, Flip Chip, Modules, SIPs and other advanced packages at varying readiness stages, with emphasis on