Packaging Engineer: Design Next-Gen Semiconductor Packages

Texas Instruments; Bouchard (TX); On-site; USD 65,000 - 90,000; Full time

Job summary

Texas Instruments is seeking a Packaging engineer to join the 12-month TMG Development program for new graduates. You will collaborate across teams to design, develop and analyze packaging technologies to enable differentiation for TI's analog and embedded products.

In this fast-paced environment you will gain hands-on experience with Wirebond, Flip Chip, Modules and other advanced packages, with focus on reliability and yield.

Responsibilities

• Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
• Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
• Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
• Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs

Job description

Texas Instruments is seeking a Packaging engineer to join the 12-month TMG Development program for new graduates. You will collaborate across teams to design, develop and analyze packaging technologies to enable differentiation for TI's analog and embedded products.

In this fast-paced environment you will gain hands-on experience with Wirebond, Flip Chip, Modules and other advanced packages, with focus on reliability and yield.