Packaging Engineering Intern: Shape Next-Gen Semiconductors

Texas Instruments; Dallas (TX); On-site; USD 30,000 - 39,000; Full time

Job summary

Texas Instruments is seeking a Packaging Engineering Intern to help design, develop, and analyze semiconductor packaging technologies such as Wirebond, Flip Chip, Modules and SIPs. You will collaborate with cross‑functional teams to deliver solutions across material, mechanical, thermal, and electrical characterization, enabling high reliability and performance.

The role emphasizes teamwork, initiative, and timely project delivery within a fast‑paced environment, with TI supporting your career

Qualifications

• Pursuing a Bachelor's degree in a relevant engineering field.
• Cumulative 3.0/4.0 GPA or higher.

Skills

Semiconductor packaging knowledge

Analytical and problem solving

Written and verbal communication

Team collaboration

Time management

Relationship building

Initiative and drive for results

Education

Bachelor's degree in Mechanical Engineering / Materials Science / Chemical Engineering / Physics / Electrical Engineering

Job description

Texas Instruments is seeking a Packaging Engineering Intern to help design, develop, and analyze semiconductor packaging technologies such as Wirebond, Flip Chip, Modules and SIPs. You will collaborate with cross‑functional teams to deliver solutions across material, mechanical, thermal, and electrical characterization, enabling high reliability and performance.

The role emphasizes teamwork, initiative, and timely project delivery within a fast‑paced environment, with TI supporting your career