Advanced Semiconductor Packaging Intern (MS/PhD)

Texas Instruments; Dallas (TX); On-site; USD 28,000 - 41,000; Full time

Job summary

Texas Instruments invites aspiring engineers to join our Packaging Engineering Intern program in Dallas to help design, develop, and analyze semiconductor packaging technologies across multiple product lines.

You will participate in cross-functional teams, contribute to material, thermal, and electrical characterization, and gain hands-on experience with advanced packaging methods such as Wirebond, Flip Chip, and SIPs while building strong professional relationships.

Qualifications

• Minimum requirements include a Master’s degree in Mechanical Engineering, Materials Science, Chemical Engineering, Optical Science, Electrical Engineering or related.
• GPA of 3.0/4.0 or higher.

Responsibilities

• Interface across various work areas to help with design, development, and analysis of semiconductor packaging technologies.
• Participation in cross-functional teams to develop internal and external solutions for packaging technologies.

Skills

Strong written and verbal comms

Analytical and problem solving

Teamwork and collaboration

Time management

Relationship building

Adaptability in fast-paced environment

Initiative and drive for results

Education

Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Optical Science, or Electrical Engineering

Tools

AutoCAD

FEM modeling

VI Scopes

X-ray inspection

Materials characterization

FA techniques

Job description

Texas Instruments invites aspiring engineers to join our Packaging Engineering Intern program in Dallas to help design, develop, and analyze semiconductor packaging technologies across multiple product lines.

You will participate in cross-functional teams, contribute to material, thermal, and electrical characterization, and gain hands-on experience with advanced packaging methods such as Wirebond, Flip Chip, and SIPs while building strong professional relationships.