Packaging Engineering Intern — Semiconductors & Innovation

Texas Instruments; Dallas (TX); On-site; USD 30,000 - 39,000; Full time

Job summary

Texas Instruments is seeking a Packaging Engineering Intern to help design, develop, and analyze semiconductor packaging technologies across multiple product lines. You will collaborate with cross-functional teams to drive solutions for Wirebond, Flip Chip, Modules and SIPs, supporting advancements in miniaturization, reliability and performance.

The internship requires enrollment in a Masters program in engineering, a 3.0 GPA or higher, and Foundations in heat transfer, stress analysis, and

Qualifications

• Pursuing a Masters degree in an engineering-related field.
• Cumulative GPA 3.0/4.0 or higher.

Responsibilities

• Assist in design, development and analysis of semiconductor packaging technologies.
• Collaborate with cross-functional teams to develop internal and external packaging solutions.
• Engage in material, mechanical, thermal and electrical characterization.

Skills

AutoCAD

FEM modeling

Heat transfer

Thermodynamics

Stress analysis

MEMS/3D integration

X-ray inspection

Education

Masters in Mechanical Engineering or related

Tools

VI Scopes

Job description

Texas Instruments is seeking a Packaging Engineering Intern to help design, develop, and analyze semiconductor packaging technologies across multiple product lines. You will collaborate with cross-functional teams to drive solutions for Wirebond, Flip Chip, Modules and SIPs, supporting advancements in miniaturization, reliability and performance.

The internship requires enrollment in a Masters program in engineering, a 3.0 GPA or higher, and Foundations in heat transfer, stress analysis, and