Packaging Engineering Intern MS/PhD

Texas Instruments Incorporated; United States; On-site; USD 90,000 - 140,000; Full time

Job summary

Texas Instruments is seeking a packaging-focused engineer to interface across multiple work areas to help with the design, development, and analysis of semiconductor packaging technologies for TI's analog and embedded processing products.

You may participate in cross-functional teams to develop internal and external solutions for packaging technologies at different stages of readiness, including Wirebond, Flip Chip, Modules, SIPs, and other advanced packages.

Job description

Change the world. Love your job.

Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. Assignments may include participation in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.