Packaging Engineering Intern: Advanced Packages

Texas Instruments Incorporated; Dallas, Northern (TX, KY); Hybrid; USD 25,000 - 30,000; Full time

Job summary

Texas Instruments Incorporated is seeking a Packaging Engineering Intern in Dallas to contribute to the design, development, and analysis of advanced semiconductor packaging technologies. You will work with cross-functional teams to develop internal and external solutions across Wirebond, Flip Chip, Modules, SIPs and other packages.

The role focuses on material, mechanical, thermal, and electrical characterization to enable differentiation in TI's analog and embedded processing products.

Responsibilities

• Assist in the design, development, and analysis of semiconductor packaging technologies.
• Collaborate with cross-functional teams to develop internal and external packaging solutions.

Job description

Texas Instruments Incorporated is seeking a Packaging Engineering Intern in Dallas to contribute to the design, development, and analysis of advanced semiconductor packaging technologies. You will work with cross-functional teams to develop internal and external solutions across Wirebond, Flip Chip, Modules, SIPs and other packages.

The role focuses on material, mechanical, thermal, and electrical characterization to enable differentiation in TI's analog and embedded processing products.