Media & Collateral Innovation Engineer

Intel Corporation; Phoenix (AZ); On-site; USD 115,110 - 162,500; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Paid vacation

Job summary

Intel Corporation in Phoenix, AZ is seeking a TD Media and Collaterals Development Engineer to design and optimize media and collaterals for assembly processes, delivering innovative solutions for future packaging technologies.

The role emphasizes DOE/SPC knowledge, mechanical design using SolidWorks or AutoCAD, and hands-on work with assembly equipment and materials to meet quality, reliability, and yield goals on aggressive schedules.

Qualifications

• BS/MS/PhD in Mechanical Engineering/Materials Engineering/Electrical Engineering/Physics related field.
• Minimum 6 months of experience in fundamental science and engineering concepts with SPC and/or DOE principles.
• Strong mechanical design software experience (SolidWorks, AutoCAD) and portfolio of self-completed projects.

Skills

SPC

DOE

Mechanical design

SolidWorks

AutoCAD

Semiconductor processes

Education

BS/MS/PhD in Mechanical/Materials/Electrical/Physics

Tools

SolidWorks

AutoCAD

Job description

Intel Corporation in Phoenix, AZ is seeking a TD Media and Collaterals Development Engineer to design and optimize media and collaterals for assembly processes, delivering innovative solutions for future packaging technologies.

The role emphasizes DOE/SPC knowledge, mechanical design using SolidWorks or AutoCAD, and hands-on work with assembly equipment and materials to meet quality, reliability, and yield goals on aggressive schedules.