Packaging Engineer: High-Voltage Power Modules

Texas Instruments Incorporated; Dallas (TX); Presencial; USD 110.000 - 160.000; Jornada completa

Descripción de la vacante

Texas Instruments Incorporated seeks a Packaging engineer to define, design and scale high-voltage packages and high-power modules for Industrial, Automotive, Renewable and Telecom markets. The role interfaces with multiple product groups and cross-functional teams to accelerate development and time-to-market.

You will validate HV concepts with CFD, thermomechanical and electrical parasitic extraction tools, and drive new process flows to scale from prototype to high-volume manufacturing while

Formación

• Must understand market trends and end equipment system requirements and translate into package roadmaps.
• Ability to define solutions across HV technologies (GaN, SiC, IGBT, isolation) and validate using CFD and thermomechanical/electrical parasitic extraction tools.
• Develop new process flows/technologies to create first article prototypes and scale to high-volume manufacturing.

Responsabilidades

• Define, design and scale high-voltage (200-3300V) packages and high-power modules for Industrial, Automotive, Renewable and Telecom markets.
• Outline package reliability plans, complete testing, summarize failure modes and provide solutions.
• Collaborate across worldwide cross-functional teams to accelerate development and time-to-market.

Conocimientos

High voltage packaging

GaN/SiC/IGBT knowledge

Module design

Cross-functional leadership

CFD tools

Thermomechanical analysis

Herramientas

CFD tools

Parasitic extraction tools

Descripción del empleo

Texas Instruments Incorporated seeks a Packaging engineer to define, design and scale high-voltage packages and high-power modules for Industrial, Automotive, Renewable and Telecom markets. The role interfaces with multiple product groups and cross-functional teams to accelerate development and time-to-market.

You will validate HV concepts with CFD, thermomechanical and electrical parasitic extraction tools, and drive new process flows to scale from prototype to high-volume manufacturing while