Power Packaging Engineer - Datacenter & Automotive

Texas Instruments Incorporated; Bouchard (TX); On-site; USD 90,000 - 150,000; Full time

Job summary

Texas Instruments Incorporated is seeking a packaging engineer to develop substrates, mold compounds, and other packaging materials for power devices with a focus on datacenter and automotive applications.

The role involves collaboration with product lines, AT sites, and suppliers to define package requirements, co-design and qualify new power packages, and perform design tradeoffs to optimize performance, cost, and reliability.

Responsibilities

• Develop and enhance substrates, mold compound, and other packaging materials for power devices with focus on datacenter and automotive applications
• Collaborate with product lines, AT sites, and suppliers to define package requirements and roadmaps for power devices
• Co-design and qualify new power packages and capabilities with various product groups
• Perform packaging tradeoffs between system performance, package design, cost, manufacturability, and reliability
• Utilize thermal and mechanical modeling to aid in package technology choice and design tradeoffs
• Coordinate the introduction of new package processes into production at internal/external AT sites
• Prepare and/or update specifications for piece parts of integrated circuits or semiconductor assemblies Qualifications
• Work with failure analysis team to improve designs and processes

Job description

Texas Instruments Incorporated is seeking a packaging engineer to develop substrates, mold compounds, and other packaging materials for power devices with a focus on datacenter and automotive applications.

The role involves collaboration with product lines, AT sites, and suppliers to define package requirements, co-design and qualify new power packages, and perform design tradeoffs to optimize performance, cost, and reliability.