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Texas Instruments is seeking a packaging engineer to design, develop and scale high voltage (200-3300V) packages and high-power modules for Industrial, Automotive, Renewable and Telecom markets. You will drive roadmaps, define solutions across HV technologies and validate with CFD, thermo-mechanical and electrical tools.
The ideal candidate collaborates across worldwide teams, accelerates development cycles and ensures rapid time-to-market while meeting TI roadmaps and quality standards.
Texas Instruments is seeking a packaging engineer to design, develop and scale high voltage (200-3300V) packages and high-power modules for Industrial, Automotive, Renewable and Telecom markets. You will drive roadmaps, define solutions across HV technologies and validate with CFD, thermo-mechanical and electrical tools.
The ideal candidate collaborates across worldwide teams, accelerates development cycles and ensures rapid time-to-market while meeting TI roadmaps and quality standards.