Packaging Engineer | High Voltage & high power

Texas Instruments Incorporated; Dallas (TX); Vor Ort; USD 110.000 - 160.000; Vollzeit

Zusammenfassung

Texas Instruments Incorporated seeks a Packaging engineer to define, design and scale high-voltage packages and high-power modules for Industrial, Automotive, Renewable and Telecom markets. The role interfaces with multiple product groups and cross-functional teams to accelerate development and time-to-market.

You will validate HV concepts with CFD, thermomechanical and electrical parasitic extraction tools, and drive new process flows to scale from prototype to high-volume manufacturing while

Qualifikationen

• Must understand market trends and end equipment system requirements and translate into package roadmaps.
• Ability to define solutions across HV technologies (GaN, SiC, IGBT, isolation) and validate using CFD and thermomechanical/electrical parasitic extraction tools.
• Develop new process flows/technologies to create first article prototypes and scale to high-volume manufacturing.

Aufgaben

• Define, design and scale high-voltage (200-3300V) packages and high-power modules for Industrial, Automotive, Renewable and Telecom markets.
• Outline package reliability plans, complete testing, summarize failure modes and provide solutions.
• Collaborate across worldwide cross-functional teams to accelerate development and time-to-market.

Kenntnisse

High voltage packaging

GaN/SiC/IGBT knowledge

Module design

Cross-functional leadership

CFD tools

Thermomechanical analysis

Tools

CFD tools

Parasitic extraction tools

Jobbeschreibung

Change the world. Love your job.

As a member of our Packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
Responsibilities may include:

• To define, design, develop and scale to volume production high voltage (200-3300V) packages and high-power modules for the Industrial, Automotive, Renewable and Telecom markets.
• The candidate must understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps.
• The candidate must have the ability to define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools.
• The candidate will develop new process flows/technologies necessary to create 1st article prototype and also scale to high volume manufacturing.
• The candidate should outline the package reliability plans, complete testing, summarize failure modes and provide solutions to address issues.
• The candidate must have a broad knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as process / equipment integration and must work with various suppliers to provide solutions to meet TI roadmaps.
• The candidate must be a proven leader, capable working collaboratively across worldwide cross functional teams and capable of accelerating development cycles and ensuring rapid time-to market for new products.