Packaging Engineer | High Voltage & high power

Texas Instruments; United States; On-site; USD 120,000 - 150,000; Full time

Job summary

Texas Instruments is seeking a packaging engineer to design, develop and scale high voltage (200-3300V) packages and high-power modules for Industrial, Automotive, Renewable and Telecom markets. You will drive roadmaps, define solutions across HV technologies and validate with CFD, thermo-mechanical and electrical tools.

The ideal candidate collaborates across worldwide teams, accelerates development cycles and ensures rapid time-to-market while meeting TI roadmaps and quality standards.

Job description

Change the world. Love your job.

As a member of our Packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
Responsibilities may include:

• To define, design, develop and scale to volume production high voltage (200-3300V) packages and high-power modules for the Industrial, Automotive, Renewable and Telecom markets.
• The candidate must understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps.
• The candidate must have the ability to define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools.
• The candidate will develop new process flows/technologies necessary to create 1st article prototype and also scale to high volume manufacturing.
• The candidate should outline the package reliability plans, complete testing, summarize failure modes and provide solutions to address issues.
• The candidate must have a broad knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as process / equipment integration and must work with various suppliers to provide solutions to meet TI roadmaps.
• The candidate must be a proven leader, capable working collaboratively across worldwide cross functional teams and capable of accelerating development cycles and ensuring rapid time-to market for new products.