Package Designer - 2.5D/3D High-Density Packaging

SK hynix America; San Jose (CA); On-site; USD 110,000 - 155,000; Full time

Benefits offered by this job

Top Tier health insurance

Paid time off and holidays

401k Matching

FSA for Health Care & Dependent Care

Educational reimbursement

Donation Matching

Job summary

SK hynix America is seeking a skilled Package Designer for our Packaging Engineering team. You will design and optimize high-density semiconductor packages for next‑generation products, collaborating with PCB, SI/PI, thermal, and manufacturing teams to ensure manufacturability and cost‑effectiveness.

The role requires hands-on experience with advanced packaging, strong communication, and the ability to work across cross-functional groups in a fast-paced environment. Onsite work in the U.S.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
• 3+ years of experience in semiconductor package design or layout.
• Experience with package layout tools Cadence Allegro/Virtuoso/Innovus, Siemens Xpedition, Synopsys 3D-ICC, AutoCAD or equivalent.
• Strong understanding of high-speed signal routing and PDN.
• In-depth knowledge of 2.5D/3D packaging technologies and substrate design rules.
• Effective communication skills and ability to work in a fast-paced, cross-functional environment.
• Currently pursuing a PhD in Electrical Engineering or related field.

Responsibilities

• Design and layout of advanced semiconductor packages including Flip Chip, BGA, LGA, 2.5D/3D integration with HBM.
• Use EDA tools to create and verify package layouts.
• Perform SI and PI analysis in collaboration with SI/PI engineers.
• Perform design and what-if analyses for SIP performance.
• Create and maintain design rules, stack-ups, and layout guidelines.
• Collaborate with internal and external stakeholders on packaging development.

Skills

Effective communication

Cross-functional collaboration

Fast-paced environment adaptability

Education

Bachelors or Masters in Electrical/Mechanical/Materials Science

3+ years semiconductor package design experience

5+ years in advanced packaging technology

PhD candidate in Electrical Engineering or related field

Tools

Cadence Allegro/Virtuoso/Innovus

Siemens Xpedition

Synopsys 3D-ICC

AutoCAD

Ansys

HFSS

ADS

Job description

SK hynix America is seeking a skilled Package Designer for our Packaging Engineering team. You will design and optimize high-density semiconductor packages for next‑generation products, collaborating with PCB, SI/PI, thermal, and manufacturing teams to ensure manufacturability and cost‑effectiveness.

The role requires hands-on experience with advanced packaging, strong communication, and the ability to work across cross-functional groups in a fast-paced environment. Onsite work in the U.S.