Package Designer

SK hynix America; San Jose (CA); On-site; USD 110,000 - 155,000; Full time

Benefits offered by this job

Top Tier health insurance

Paid time off and holidays

401k Matching

FSA for Health Care & Dependent Care

Educational reimbursement

Donation Matching

Job summary

SK hynix America is seeking a skilled Package Designer for our Packaging Engineering team. You will design and optimize high-density semiconductor packages for next‑generation products, collaborating with PCB, SI/PI, thermal, and manufacturing teams to ensure manufacturability and cost‑effectiveness.

The role requires hands-on experience with advanced packaging, strong communication, and the ability to work across cross-functional groups in a fast-paced environment. Onsite work in the U.S.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
• 3+ years of experience in semiconductor package design or layout.
• Experience with package layout tools Cadence Allegro/Virtuoso/Innovus, Siemens Xpedition, Synopsys 3D-ICC, AutoCAD or equivalent.
• Strong understanding of high-speed signal routing and PDN.
• In-depth knowledge of 2.5D/3D packaging technologies and substrate design rules.
• Effective communication skills and ability to work in a fast-paced, cross-functional environment.
• Currently pursuing a PhD in Electrical Engineering or related field.

Responsibilities

• Design and layout of advanced semiconductor packages including Flip Chip, BGA, LGA, 2.5D/3D integration with HBM.
• Use EDA tools to create and verify package layouts.
• Perform SI and PI analysis in collaboration with SI/PI engineers.
• Perform design and what-if analyses for SIP performance.
• Create and maintain design rules, stack-ups, and layout guidelines.
• Collaborate with internal and external stakeholders on packaging development.

Skills

Effective communication

Cross-functional collaboration

Fast-paced environment adaptability

Education

Bachelors or Masters in Electrical/Mechanical/Materials Science

3+ years semiconductor package design experience

5+ years in advanced packaging technology

PhD candidate in Electrical Engineering or related field

Tools

Cadence Allegro/Virtuoso/Innovus

Siemens Xpedition

Synopsys 3D-ICC

AutoCAD

Ansys

HFSS

ADS

Job description

About SK hynix America:

At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.

About SK hynix America:

At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.

Work Model:

Onsite

Job Summary:

We are seeking a skilled Package Designer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density semiconductor packages for next‑generation semiconductor products. You’ll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost‑effective package solutions.

Responsibilities:

• Design and layout of advanced semiconductor packages including Flip Chip, BGA, LGA, 2.5D/3D heterogeneous integration with High Bandwidth Memory (HBM)
• Use EDA tools (Cadence Allegro/Virtuoso/Innovus, Siemens Xpedition, Synopsys 3D-ICC etc.) to create and verify package layouts
• Perform Signal Integrity (SI) and Power Integrity (PI) analysis in collaboration with SI/PI engineers
• Perform design and what-if scenario analysis for novel advanced packaging schemes to improve system-in-package (SIP) performance.
• Create and maintain design rules, stack-ups, and layout guidelines
• Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development

Minimum Qualifications:

• Bachelor’s or Master’s degree in Electrical Engineering (Preferred), Mechanical Engineering, Materials Science, or a related field
• 3+ years of experience in semiconductor package design or layout
• Proven experience with package layout tools (Cadence Allegro/Virtuoso/Innovus, Siemens Xpedition, Synopsys 3D-ICC, Autocad or equivalent)
• Strong understanding of high-speed signal routing and power distribution networks (PDN)
• In-depth knowledge in 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies
• Effective communication skills and ability to work in a fast‑paced, cross‑functional environment

Preferred Qualifications:

• Currently pursuing a PhD's degree in Electrical Engineering or a related field
• 5+ years of experiences in advanced packaging technology development and manufacturing
• Experience with SI/PI simulation tools (Ansys, HFSS, ADS)
• Proven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniques

Benefits:

• Top Tier health insurance at no employee cost
• Paid day offs: Paid Time Off, Company Holidays, Parental Leave, Happy Fridays
• 401k Matching
• Flexible Spending Account (FSA) for Health Care & Dependent Care
• Educational reimbursement up to Ten Thousand Dollars per year
• Donation Matching and volunteering opportunities
• Corporate discount programs
• Free Breakfast/Lunch/Dinner provided to employees

Compensation:Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.

Pay Range: $110,000 USD - $155,000 USD

Equal Employment Opportunity:

SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information, or any other status protected under federal, state, or local applicable laws.

In compliance with federal law, SK hynix America also participates in the federal E-Verify program. Upon accepting an offer of employment, all newly hired individuals will be required to complete Form I-9, which includes verifying identity and legal authorization to work in the United States. Please review the official government posters detailing your rights and protections prior to applying:

• E-Verify Participation Poster (Bilingual English & Spanish)
• IER Right to Work Poster (English)
• IER Right to Work Poster (Spanish)