Optical Packaging Engineer – SiPh & CPO Expert

Global Foundries; Essex Junction (VT); On-site; USD 107,000 - 205,000; Full time

Job summary

GlobalFoundries in the United States (Vermont) seeks a Photonic Packaging Engineer to lead development and sustainment of optical packaging for SiPh and co-packaged optics platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss packaging architectures that meet stringent performance and reliability targets.

Essential responsibilities include defining and qualifying optical packaging architectures, developing fiber-to-chip

Qualifications

• Masters degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field.
• 5+ years in semiconductor packaging with photonic/advanced packaging focus.
• Hands-on fiber attach, photonic alignment, and optical coupling experience.

Responsibilities

• Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
• Develop and implement scalable fiber-to-chip coupling strategies for high-density optical I/O.
• Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).
• Perform multiphysics simulations to optimize package performance and reliability.
• Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.
• Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.
• Support cost modeling and drive package cost reduction initiatives aligned with GF's B2B supply chain strategy.
• Present technical updates and roadmaps to internal stakeholders and external partners.

Skills

Fiber attach

Photonic alignment

Optical coupling

English communication

Education

Masters degree in packaging or related field

Tools

Lumerical

COMSOL

Python

Job description

GlobalFoundries in the United States (Vermont) seeks a Photonic Packaging Engineer to lead development and sustainment of optical packaging for SiPh and co-packaged optics platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss packaging architectures that meet stringent performance and reliability targets.

Essential responsibilities include defining and qualifying optical packaging architectures, developing fiber-to-chip