SiPh Packaging Engineer: Optical I/O & Co-Packaging

Apple; United States; On-site; USD 120,000 - 180,000; Full time

Job summary

Apple is seeking a hardworking Si photonics & optical packaging engineer to join our team in the United States. You will develop Si photonics engine/chiplet packaging and co-packaging solutions, defining assembly baseline processes and BOMs, and optimizing optical coupling design for performance, reliability, yield and cost.

The role requires leading packaging technology development, collaborating with cross-functional teams, vendors, foundries, and OSAT to bring packaging solutions from concept

Qualifications

• BS and 3+ years of relevant industry experience.
• Strong theoretical background in optics and photonics fundamentals.
• Hands-on packaging and measuring fiber-coupled devices.
• Experience with optical component design, simulation and qualification, and single/multi-mode fiber assembly.

Responsibilities

• Lead Si photonics packaging technology development and co-packaging efforts.
• Define assembly baseline processes and package BOM; establish optical coupling design/manufacturing.
• Collaborate with optical component vendors, foundry and OSAT to bring packaging solutions from concept to high-volume manufacturing.

Skills

Optics fundamentals

Device integration

Active alignment

Fiber coupling

Simulation tools

CMOS BEOL

CoC/CoW/WLP

Cross-functional collaboration

Communication skills

Education

Bachelor's degree

Job description

Apple is seeking a hardworking Si photonics & optical packaging engineer to join our team in the United States. You will develop Si photonics engine/chiplet packaging and co-packaging solutions, defining assembly baseline processes and BOMs, and optimizing optical coupling design for performance, reliability, yield and cost.

The role requires leading packaging technology development, collaborating with cross-functional teams, vendors, foundries, and OSAT to bring packaging solutions from concept