TD Media and Collaterals Development Engineer

Intel; Phoenix (AZ); On-site; USD 85,000 - 120,000; Full time

Job summary

Intel seeks an experienced engineer in Phoenix to develop assembly processes and equipment for next‑generation packaging. You will optimize package manufacturing to meet quality, reliability, cost, yield, and productivity targets, and define specifications using DOE and SPC methods.

The role requires strong CAD skills in SolidWorks and AutoCAD, plus a portfolio of projects from concept to fabrication. On-site work in Phoenix is expected.

Qualifications

• Bachelor’s degree in mechanical engineering, materials engineering, electrical engineering or physics (or a related field).
• Master’s degree in mechanical engineering, materials engineering, electrical engineering or physics is a plus.
• Minimum 6 months of experience applying SPC and DOE principles to develop novel solutions.

Responsibilities

• Develops assembly processes and equipment to enable Intel’s roadmap for future packaging platform technologies.
• Optimizes manufacturing of packages to meet quality, reliability, cost, yield, and productivity requirements.
• Develops process/equipment specifications and documents improvements with DOE and data analysis.

Skills

SPC

DOE

Mechanical design

Education

Bachelor's in mechanical engineering/Materials/Electrical/Physics

Master’s in mechanical engineering/Materials/Electrical/Physics

Tools

SolidWorks

AutoCAD

Job description

Job Details

Job Description:

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

• Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
• Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
• Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
• Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.
• Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms. Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
• Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.
• Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications

• Bachelor's in mechanical engineering/Material Engineering/Electrical Engineering/Physics related technical discipline or a master’s in mechanical engineering/Material Engineering/Electrical Engineering/Physics
• Minimum 6 months of experience in fundamental science and engineering concepts in development to create novel solutions, including strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.

This position is not open to an Intel immigration sponsorship

Preferred Qualifications

• Strong mechanical design software experience (SolidWorks, AutoCAD, etc)
• Portfolio of self-completed project examples from concept to fabrication
• Assembly equipment, process, media, and/or collateral experience
• Technical innovation and deliver results for complex, time critical technical projects.
• Understanding of semiconductor fabrication processes and technology with technical and analytical skills.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Arizona, Phoenix

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $85,200.00 - 120,280.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.