On-Site High-Speed IC Package Design Engineer

Socket.dev; California (MO); On-site; USD 83,000 - 132,000; Full time

Job summary

Broadcom is seeking an IC package-design engineer to develop flip-chip-BGA packages for high-speed SerDes and high-power ASICs. You will collaborate with a worldwide R&D team to create robust package structures for AI, networking, HPC, and 5G applications.

You will own design aspects including SI/PI, reliability, manufacturability and thermal, and work on SerDes, DDR, ADC/DAC and HBM. This on-site role requires Cadence/APD experience and teamwork across time zones, with opportunities for process

Qualifications

• Requires BSEE or higher with 2+ years in flip-chip-BGA design, SerDes preferred.
• Strong understanding of electrical fundamentals.
• Familiarity with package-level SI/PI for designs is preferred.
• Cadence APD/Allegro experience preferred; other layout tools acceptable.

Responsibilities

• Own ASIC package designs with SI/PI/thermal and manufacturability considerations.
• Design critical structures for SerDes, ADC/DAC, DDR, etc.
• Schedule, prioritize, and track work across 2+ projects.
• Perform general flip-chip BGA package design and engineering.
• Manage projects and interface with customers.

Skills

Flip-chip-BGA design

Signal integrity

Self-management

Cross-time-zone collaboration

Organization

Education

BSEE or similar

MSEE or PhD

Tools

Cadence APD/Allegro

Cadence SKILL

Equivalent layout tool

Job description

Broadcom is seeking an IC package-design engineer to develop flip-chip-BGA packages for high-speed SerDes and high-power ASICs. You will collaborate with a worldwide R&D team to create robust package structures for AI, networking, HPC, and 5G applications.

You will own design aspects including SI/PI, reliability, manufacturability and thermal, and work on SerDes, DDR, ADC/DAC and HBM. This on-site role requires Cadence/APD experience and teamwork across time zones, with opportunities for process