Package Design Engineer

Broadcom Inc.; San Jose (CA); On-site; USD 141,300 - 226,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

401(K) with company matching

Employee Stock Purchase Program

Job summary

Broadcom Inc. is seeking an experienced Package Design Engineer located in San Jose, CA. The role involves the design of package structures for advanced ASICs, including high-speed SerDes technologies.

The ideal candidate will have substantial experience in flip-chip-BGA package design, a solid background in signal and power integrity, as well as project management skills. This full-time position requires working on-site five days a week.

Broadcom offers a competitive salary and comprehensive benefits, including health plans and an equity program.

Qualifications

• 12+ years of experience in flip-chip-BGA package design, or 10+ years with MSEE.
• Experience in high-speed SerDes design preferred.
• Self-management and organization skills.

Responsibilities

• Design ASIC packages for various applications, including AI and HPC.
• Manage and track work across multiple projects.
• Collaborate with global teams on critical package engineering.

Skills

Package-level signal integrity

Power integrity

Project management

Design-automation coding (Cadence SKILL)

Education

BSEE or equivalent

MSEE or equivalent

Tools

Cadence APD

Job description

## Package Design EngineerApplylocations: USA-CA San Jose Innovation Drive: USA-TX-Austin - River Place B7: USA-Colorado-Fort Collins-4380 Ziegler Roadtime type: Full timeposted on: Posted 13 Days Agojob requisition id: R024439**Please Note:****1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)****2. If you already have a Candidate Account, please Sign-In before you apply.**## **Job Description:**Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team. **RESPONSIBILITIES:*** Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.* Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.* Schedule, prioritize, & track your work across 2+ projects simultaneously* General flip-chip BGA package design & engineering* Project management and customer interface for your design projects* Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.* Physical design (layout) is a foundational responsibility in this role **EDUCATION/EXPERIENCE & REQUIREMENTS:*** BSEE or similar field and 12+ years’ experience in flip-chip-BGA package design, including high-speed SerDes **or** MSEE or similar field and 10+ years’ work experience* Knowledge of package-level signal integrity and power integrity, to apply to package designs* Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.* Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers* Self-management and organization skills* Preferred candidates will also have 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest**OTHER REQUIREMENTS*** This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position**Additional Job Description:****Compensation and Benefits**The annual base salary range for this position is $141,300 - $226,000.This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.**Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.**