ASIC Package Design Manager

Broadcom Inc.; Fort Collins (CO); On-site; USD 143,800 - 230,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(K) with company matching

Employee Stock Purchase Program (ESPP)

Employee Assistance Program (EAP)

Company paid holidays

Sick leave and vacation

Job summary

Broadcom Inc. seeks an experienced IC Package Design Manager to lead a team of engineers designing complex flip‑chip‑BGA packages for ASICs with high‑speed SerDes and high power delivery.

You will guide technical methodologies and project management for a worldwide R&D effort focused on AI, HPC, networking, and 5G applications. The role requires 12+ years in flip‑chip‑BGA package design, including high‑speed SerDes, and at least 3 years in management, with strong SI/PI awareness and DFx

Qualifications

• Experience leading people and projects.
• 12+ years in flip-chip-BGA package design, incl. high-speed SerDes.
• Knowledge of package-level signal integrity and power integrity.
• Collaborate with global teams and external vendors.
• Strong self-management and organizational skills.
• Understand package design lifecycle and how substrate fits ASIC flows.
• Experience with Design for X (DFx) trade-offs and SI/PI.

Responsibilities

• Understand team members' skills to maximize productivity.
• Create and track project plans for 20+ concurrent designs.
• Organize team and customer activities to keep projects on track.
• Communicate plans, status, next steps and risks.
• Create technical methodologies for package design.
• Steer package technology and design rules with team input.
• Collaborate with customers, vendors, and cross-functional teams.

Skills

Team leadership

Project management

Cross-functional collaboration

Self-management

Education

BSEE/MSEE or similar

12+ years flip-chip-BGA package design

Job description

Job Description

Broadcom is seeking an experienced IC Package Design Manager to lead a team of engineers designing complex flip‑chip‑BGA packages for industry‑leading ASICs with high‑speed SerDes and very‑high‑power‑delivery needs. You will be part of a worldwide R&D team developing high‑performance package designs for ASICs for artificial intelligence ("AI"), networking, high‑performance computing ("HPC"), and 5G base stations. These designs include SerDes at 448G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. In this role, you will support and develop the engineering team, as well as contribute to technical methodologies and project management.

RESPONSIBILITIES

• Understand the skill sets and traits of each team member, in order to maximize productivity and retention
• Project Management : Create and track project plans for 20+ concurrent designs (scope, schedules, resources)
• Organize team & customer activities to keep projects on track
• Communicate plans, status, next steps and risks
• Create technical methodologies for package design
• Steering package technology and design rules, with input from team members
• Customer, vendor, & cross‑functional collaboration

EDUCATION/EXPERIENCE & REQUIREMENTS

• Preferred candidates have previous experience managing people and projects
• BSEE/MSEE or similar field and 12+ years of experience in flip‑chip‑BGA package design, including high‑speed SerDes, with a minimum of 3 years in management
• Knowledge of package‑level signal integrity and power integrity, to apply to package designs
• Cooperate with our world‑wide team (multiple time zones), including co‑design with internal team members and external (Vendor) designers
• Self‑management and organization skills
• Technical understanding related to package design: Package‑Design lifecycle
• How the substrate and package fit into the overall ASIC design and manufacturing flows
• Design Data, including how it is created and used: .mcm, package spreadsheet, drawings (POD, Lid, Substrate)
• DFx trade offs (Design for “x”, where is x is manufacturability, reliability, assurance of supply, SI/PI, etc)
• Layout SI/PI extractions and Simulations
• Automation code development
• Mechanical & Thermal modeling
• Project Management New Business Quotes

OTHER REQUIREMENTS

This job requires working on‑site at the Broadcom office, 5 days a week. This is not a remote‑work position Occasional travel may be required

Compensation and Benefits

The annual base salary range for this position is USD 143,800.00 To USD 230,000.00 As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package:

• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• company paid holidays
• paid sick leave and vacation time

Broadcom follows all applicable laws for Paid Family Leave and other leaves of absence.

Equal Opportunity Employer

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.

We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. For more information please visit our video library and check out our Connected by Broadcom series. Follow us on Linked In Broadcom Inc.