Package Design Engineer

Socket.dev; California (MO); On-site; USD 83,000 - 132,000; Full time

Job summary

Broadcom is seeking an IC package-design engineer to develop flip-chip-BGA packages for high-speed SerDes and high-power ASICs. You will collaborate with a worldwide R&D team to create robust package structures for AI, networking, HPC, and 5G applications.

You will own design aspects including SI/PI, reliability, manufacturability and thermal, and work on SerDes, DDR, ADC/DAC and HBM. This on-site role requires Cadence/APD experience and teamwork across time zones, with opportunities for process

Qualifications

• Requires BSEE or higher with 2+ years in flip-chip-BGA design, SerDes preferred.
• Strong understanding of electrical fundamentals.
• Familiarity with package-level SI/PI for designs is preferred.
• Cadence APD/Allegro experience preferred; other layout tools acceptable.

Responsibilities

• Own ASIC package designs with SI/PI/thermal and manufacturability considerations.
• Design critical structures for SerDes, ADC/DAC, DDR, etc.
• Schedule, prioritize, and track work across 2+ projects.
• Perform general flip-chip BGA package design and engineering.
• Manage projects and interface with customers.

Skills

Flip-chip-BGA design

Signal integrity

Self-management

Cross-time-zone collaboration

Organization

Education

BSEE or similar

MSEE or PhD

Tools

Cadence APD/Allegro

Cadence SKILL

Equivalent layout tool

Job description

Job Description

Broadcom is seeking an IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.

• Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
• Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.
• Schedule, prioritize, & track your work across 2+ projects simultaneously
• General flip-chip BGA package design & engineering
• Project management and customer interface for your design projects
• Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.
• Physical design (layout) is a foundational responsibility in this role

EDUCATION/EXPERIENCE & REQUIREMENTS

• BSEE or similar field and 2+ years’ experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or PhD
• Knowledge of electrical engineering fundamentals
• Preferred candidates have a working knowledge of package-level signal integrity and power integrity, to apply to package designs
• Cadence APD (allegro package designer) experience is preferred. Equivalent layout tool is OK.
• Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
• Self-management and organization skills
• Preferred candidates will also have1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest

OTHER REQUIREMENTS

• This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position.

Compensation and Benefits

The annual base salary range for this position is USD 82,500.00 To USD 132,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.