On-Shift Module Engineer, Advanced Packaging Tech
Intel
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Benefits offered by this job
Job summary
Intel's Advanced Packaging Technology Development Substrate and Wafer Assembly (APTD SWA) organization seeks a Module Engineer On Shift to provide real-time factory support, addressing equipment and process issues and ensuring continuous 24/7 lot movement on the production line in Phoenix.
The MEOS role emphasizes troubleshooting, RFCs, tool enablement, and collaboration across engineering teams, with opportunities to impact packaging technology and product quality in a fast-paced semiconductor
Qualifications
- Bachelor's degree with 2+ years in lithography and etch processes.
- Master's degree with 1+ year in lithography and etch processes.
- Experience with DOE and SPC methodologies.
Responsibilities
- Receive and align shift priorities based on management guidance.
- Support equipment/process issues on the factory floor; create/update RFCs as needed.
- Execute non-standard procedures and panel inspections to collect data.
- Communicate critical issues to tool owners and stakeholders.
- Provide shift pass-downs for operational continuity.
- Support tool qualification and enablement activities.
- Assist with lot disposition decisions and process recovery actions.
- Collaborate with cross-functional teams to ensure production flow.
Skills
Education
Job description
Intel's Advanced Packaging Technology Development Substrate and Wafer Assembly (APTD SWA) organization seeks a Module Engineer On Shift to provide real-time factory support, addressing equipment and process issues and ensuring continuous 24/7 lot movement on the production line in Phoenix.
The MEOS role emphasizes troubleshooting, RFCs, tool enablement, and collaboration across engineering teams, with opportunities to impact packaging technology and product quality in a fast-paced semiconductor
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