MEOS - Module Engineer On Shift

Intel

Phoenix (AZ)

On-site

USD 99,000 - 140,000

Full time

5 days ago
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Benefits offered by this job

Stock bonuses
Health insurance
Retirement plan
Paid vacation

Job summary

Intel in the United States (Arizona, Phoenix) seeks an experienced ATTD Microelectronic Packaging Engineer to manage projects, design/develop packages, and sustain IC assemblies. You will lead DOE activities, support NPIs, and coordinate with Manufacturing on issues, ensuring data collection and process improvements on the floor.

The role emphasizes hands-on floor time, cross-functional collaboration, and ownership of quality excursions with strong documentation and teamwork.

Qualifications

  • Bachelor’s degree with 2+ years of relevant experience.
  • Master’s degree with 6+ months of relevant experience.

Responsibilities

  • Prioritize and organize daily activities around multiple requests for engineering DOEs, pre-ops meeting prep, documentation and AR tracking.
  • Be experts in all tools and processes in the area to support elaborate DOEs and NPIs.
  • Coach and role model the correct execution of module operations.
  • Clearly understand and communicate execution issues, quality excursions, and equipment problems to Engineering and Manufacturing teams.
  • Prepare and execute New Product Introductions, including evaluation of recipe needs and creation.

Skills

Technical problem solving
Cross-functional collaboration

Education

Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or related field
Master’s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or related field

Job description

Job Details

Job Description: Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

Key Responsibilities
  • Prioritize and organize daily activities around multiple requests for engineering DOEs, pre-ops meeting preparation, documentation and AR tracking, and quick and effective response to production issues.
  • Be experts in all tools and processes in the area to support elaborate DOEs and NPIs.
  • Be able to coach and role model the correct execution of module operations.
  • Clearly understand and communicate execution issues, quality excursions, and equipment problems to Engineering and Manufacturing teams.
  • Apply correctly and effectively the POR tools and methods to contain, mitigate and solve issues, including: XTREAMs and Spec RFCs, Wiki / Documented BKMs / MITTS records / Tool error and troubleshooting message, 5M+E checklists, Tool log files / SC logs / SPC++ / E3 / ATRMS / Feedback files, MBPS (is/is-not, models, validation data). Escalations or pass down must include full documentation of steps and results obtained to that point, plus any next steps or recommendations.
  • Ensure all Out-of-Control events have been annotated, reviewed and issues communicated for resolution
  • First point of contact for Manufacturing.
  • Spend more than 3/4 of your time on the floor.
  • Disposition/release un-scheduled hold lots within 10 hours and scheduled hold lots within 24 hours.
  • Support Manufacturing on resolving any product recipe or parameter issues.
  • Keep all Operation and Recipe Creation specs up to date.
  • Initiate the investigation and documentation of quality excursions for the area, in partnership with Manufacturing and Factory Quality teams. Assume initial ownership where RC is not evident.
  • Prepare and execute New Product Introductions, including evaluation of recipe needs, collateral ordering, and recipe creation.
  • Understand and ensure all data is collected on critical lots.
  • Consolidate and prioritize area improvement projects with Manufacturing
  • Support Working Group and Task Force activities, executing experiments and providing engineering data.
  • Support MTEs on resolving any equipment issue.
  • Complete clear pass downs for issues seen and resolutions found.
  • Support early processing of lots through new operations, then provide training, certification and final endorsement to Manufacturing.
The Candidate Should Exhibit The Following Behavioral Traits
  • Strong technical problem-solving abilities with the ability to analyze and implement solutions in a dynamic operations environment.
  • Demonstrated ability to collaborate with cross-functional teams and prioritize multiple activities effectively.
Qualifications
Minimum Qualifications:
  • Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or a related field with 2+ years of relevant experience.
  • Master’s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or a related field with 6+ months of relevant experience.
Experience Listed Above Should Be In Any The Following
  • Semiconductor Equipment Development and/or Manufacturing
  • Semiconductor Product Development and/or Manufacturing
  • High Volume Technology Manufacturing
  • Automated Manufacturing

This position is not eligible for Intel Immigration Sponsorship

Preferred Qualifications
  • High Volume Manufacturing experience is a plus.
  • Engineering experience in Semiconductor Fab or Package Assembly is a plus.
Job Type

Experienced Hire

Shift

Shift 6 (United States of America)

Primary Location: US, Arizona, Phoenix

Additional Locations:

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $99,030.00 - 139,810.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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