Module Development Engineer - Advanced Packaging

Intel; Hillsboro (OR); On-site; USD 155,520 - 219,550; Full time

Job summary

Intel in Hillsboro, Oregon seeks a Module Development Engineer in the Wafer Assembly Technology Development Group (WATD) to drive innovation in advanced semiconductor packaging and enable high‑volume manufacturing.

You will lead design and optimization of manufacturing processes, work with cross‑functional teams, and apply SPC and data analytics to meet performance, yield and reliability goals in next‑generation devices.

Qualifications

• Development methodologies, statistical process control, and/or data analytics.
• Wafer-level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.

Responsibilities

• Drive technology development and enablement for both high‑volume manufacturing and future technologies.
• Lead design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
• Perform feasibility studies and pathfinding activities to meet device specifications via simulations and engineering methods.
• Develop and implement technology roadmaps to guide future manufacturing needs and industry standards.
• Collaborate with equipment and material suppliers to design and implement enabling process technologies.
• Modify operational equipment to improve efficiency, scalability, and production output.
• Apply statistical process control, data analytics, and machine learning to enhance process stability and continuous improvement.
• Optimize production efficiency, manufacturing techniques, and output for existing and new products.
• Partner with cross‑functional teams to ensure process integration and alignment with project deliverables.

Skills

Statistical process control

Data analytics

Wafer-level assembly

Semiconductor equipment

Advanced packaging

Process development

Education

Bachelor's degree in STEM (Materials Science, Mechanical, Chemical, Electrical, Physics)

Master's degree in STEM (same fields)

PhD in STEM (same fields)

Job description

Intel in Hillsboro, Oregon seeks a Module Development Engineer in the Wafer Assembly Technology Development Group (WATD) to drive innovation in advanced semiconductor packaging and enable high‑volume manufacturing.

You will lead design and optimization of manufacturing processes, work with cross‑functional teams, and apply SPC and data analytics to meet performance, yield and reliability goals in next‑generation devices.