Module Engineering Manager: Lead High-Volume Packaging

Intel Corporation; Albuquerque (NM); On-site; USD 150,000 - 190,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation is seeking an experienced Module Engineering Manager in Albuquerque, NM to lead a team supporting high-volume manufacturing and advanced packaging technologies. You will drive continuous improvement, mentor engineers, and ensure safe, efficient operations across global sites.

The role emphasizes accountable leadership, collaboration with cross-functional teams, and development of long-term strategies to advance engineering capabilities in semiconductor packaging.

Qualifications

• Bachelor's degree in engineering or related technical field is required.
• 2+ years leading an engineering or manufacturing team with demonstrated ability to lead teams and drive results.
• Experience in process characterization, troubleshooting and improvement in high-volume manufacturing.
• Experience with lean manufacturing principles.

Responsibilities

• Lead and manage a team of engineers to support safe, high-volume manufacturing processes while driving continuous improvements in quality, output, cost, and yield.
• Provide tactical direction and prioritize activities for sustaining operations and process optimization.
• Collaborate with cross-functional engineering and manufacturing teams to address integrated process and equipment challenges.
• Develop and mentor engineers, fostering technical expertise and leadership growth within the team.

Skills

Engineering leadership

Lean manufacturing

Process characterization

Education

Bachelor's degree in engineering or related technical field

Job description

Intel Corporation is seeking an experienced Module Engineering Manager in Albuquerque, NM to lead a team supporting high-volume manufacturing and advanced packaging technologies. You will drive continuous improvement, mentor engineers, and ensure safe, efficient operations across global sites.

The role emphasizes accountable leadership, collaboration with cross-functional teams, and development of long-term strategies to advance engineering capabilities in semiconductor packaging.