Hybrid Semiconductor Packaging Process Engineer

Intel Corporation; Albuquerque (NM); Hybrid; USD 89,000 - 146,000; Full time

Job summary

Intel Corporation in Albuquerque, NM seeks a Module Engineer to optimize high-volume manufacturing processes, ensure equipment reliability, and improve product quality across wafer packaging lines.

The role focuses on hands-on troubleshooting, DOE and SPC application, process monitoring, and collaboration with cross-functional teams to drive manufacturability improvements. Hybrid work model available.

Qualifications

• Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or related discipline with 2+ years in manufacturing process or equipment engineering.
• Master's degree in related field is acceptable.
• Experience in Semiconductor Manufacturing or Semiconductor Packaging is preferred.
• Experience with Statistical Process Control, metrology tool recipe creation, and tool troubleshooting is preferred.

Responsibilities

• Develop, monitor, and optimize manufacturing processes to ensure operational reliability and product quality.
• Conduct tests and measurements to control critical dimensions and defectivity.
• Analyze process excursions to enhance efficiency and reduce disruptions.
• Collaborate with cross-functional teams to drive manufacturability improvements and process enhancements.
• Apply SPC and DOE methodologies to refine processes and improve yield.
• Perform maintenance, repair, and optimization of manufacturing tools and components.
• Partner with equipment suppliers to resolve operational issues and implement technological advancements.
• Oversee equipment installation, conversion, and qualification during factory ramps.

Skills

SPC

DOE methods

Metrology

Tool troubleshooting

Education

Bachelor's degree (Materials/Mechanical/Chemical Eng, Physics)

Master's degree in related field

Job description

Intel Corporation in Albuquerque, NM seeks a Module Engineer to optimize high-volume manufacturing processes, ensure equipment reliability, and improve product quality across wafer packaging lines.

The role focuses on hands-on troubleshooting, DOE and SPC application, process monitoring, and collaboration with cross-functional teams to drive manufacturability improvements. Hybrid work model available.