Advanced Packaging Module Engineer – High-Volume Wafer

Intel Corporation; Hillsboro (OR); On-site; USD 76,000 - 146,000; Full time

Benefits offered by this job

Health benefits

Stock bonuses

Retirement plan

Vacation

Job summary

Intel Corporation in Hillsboro, Oregon, is seeking an Oregon Advanced Packaging Module Engineer to drive high-volume packaging equipment and processes for next-generation ICs. You will design process controls, execute continuous improvement initiatives, and work on cutting-edge systems impacting Intel's production roadmap.

The role offers collaboration with global manufacturing sites, ownership of tooling ramps, and direct partnership with suppliers to optimize configurations for mass production

Qualifications

• Bachelor's or Master’s in a STEM field with 1+ years in semiconductor manufacturing or high-tech process equipment.
• 6+ months of experience applying statistical methods (e.g., SPC, DOE) to manufacturing processes.
• 6+ months of troubleshooting equipment or analytical instruments; experience with statistics tools and materials characterization is a plus.

Responsibilities

• Manage high-volume manufacturing equipment and processes to support device miniaturization and IC production.
• Conduct tests and measurements to maintain critical process control for dimensions and defectivity.
• Develop and monitor excursion prevention and discrepant material detection within modules.
• Coordinate with global Intel sites to transfer process qualification outcomes and align performance metrics.
• Lead continuous improvement initiatives focused on safety, quality, productivity, and cost reduction.
• Coordinate equipment installations, conversions, and qualifications during factory ramps.
• Collaborate with equipment and material suppliers to optimize tool configurations and materials for high-volume manufacturing.

Skills

Technical leadership

Problem-solving

Adaptability

Attention to detail

Education

Bachelor's degree in Mechanical Engineering or related STEM field

Master's degree in a matching STEM discipline

Tools

MATLAB

JMP

Excel

Job description

Intel Corporation in Hillsboro, Oregon, is seeking an Oregon Advanced Packaging Module Engineer to drive high-volume packaging equipment and processes for next-generation ICs. You will design process controls, execute continuous improvement initiatives, and work on cutting-edge systems impacting Intel's production roadmap.

The role offers collaboration with global manufacturing sites, ownership of tooling ramps, and direct partnership with suppliers to optimize configurations for mass production