Media & Collateral Development Engineer - Semiconductor Packaging

Intel Corporation; Chandler (AZ); On-site; USD 115,000 - 163,000; Full time

Job summary

Intel Corporation in Phoenix, AZ seeks an experienced materials and packaging technologist to develop media and collateral for assembly processes. You will optimize media quality, investigate DOE/ SPC driven improvements, and contribute to design of experiments to meet reliability and manufacturability goals.

Role requires onsite presence, with a focus on advancing packaging technology, prototyping, and collaboration with cross-functional teams to meet milestones and reduce risk in manufacturing

Qualifications

• Possess a BS/MS/PhD degree in Mechanical Engineering/Material Engineering/Electrical Engineering/Physics related field.
• Minimum 6 months of experience in fundamental science and engineering concepts in development to create novel solutions, including strong knowledge of SPC and/or DOE principles.

Skills

SPC concepts

DOE concepts

Education

BS/MS/PhD in Mechanical Engineering/Material Engineering/Electrical Engineering/Physics

Tools

SolidWorks

AutoCAD

Job description

Intel Corporation in Phoenix, AZ seeks an experienced materials and packaging technologist to develop media and collateral for assembly processes. You will optimize media quality, investigate DOE/ SPC driven improvements, and contribute to design of experiments to meet reliability and manufacturability goals.

Role requires onsite presence, with a focus on advancing packaging technology, prototyping, and collaboration with cross-functional teams to meet milestones and reduce risk in manufacturing