Module Engineer On-Shift – Day Shift (Packaging)

Intel Corporation; Phoenix (AZ); On-site; USD 85,000 - 163,000; Full time

Benefits offered by this job

Health insurance

Retirement plan

Paid time off

Job summary

Intel Corporation in Chandler, AZ, is seeking a Module Engineer On Shift (MEOS) for Day Shift to support a 24x7 manufacturing line. You will troubleshoot, document, and coordinate with Tool and Lot Owners to maintain continuous flow and data integrity.

The role emphasizes problem solving, clear communication, and adaptability in a fast-paced semiconductor packaging environment with on-site work in Arizona.

Qualifications

• Bachelor’s or Master’s in a relevant engineering/physical science discipline with 2+ years of related experience.
• Experience with metrology, lithography, or laser tools is preferred.
• Experience in semiconductor packaging or substrate manufacturing is a plus.

Responsibilities

• Provide real-time floor support to maintain 24x7 lot movement on the line.
• Receive and deliver pass-downs; align priorities with shift leadership.
• Troubleshoot process issues and perform rapid error recovery.
• Document specifications and RFCs to keep process records current.
• Perform inspection/imaging on panels and collect development data.

Skills

Metrology Tools

Exposure Lithography Tools

Laser Tools

Statistical Process Control

Education

Bachelor’s degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or related discipline

Master’s degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or related discipline

Tools

Metrology Tools

Lithography Tools

Laser Tools

Job description

Intel Corporation in Chandler, AZ, is seeking a Module Engineer On Shift (MEOS) for Day Shift to support a 24x7 manufacturing line. You will troubleshoot, document, and coordinate with Tool and Lot Owners to maintain continuous flow and data integrity.

The role emphasizes problem solving, clear communication, and adaptability in a fast-paced semiconductor packaging environment with on-site work in Arizona.