Module Engineer On-Shift (MEOS) – Night Shift (6)

Intel Corporation; Chandler (AZ); On-site; USD 99,000 - 140,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Vacation

Job summary

Intel Corporation is seeking a Module Engineer On Shift (MEOS) to join the Substrate Packaging Technology Development team in Chandler, Arizona. You will provide real-time floor support for equipment and process issues on a 6 PM–6 AM night shift, collaborating with engineers and technicians to keep 24x7 lot movement smooth.

The role requires a Bachelor’s or Master’s in a related engineering field and hands-on packaging/substrate experience.

Qualifications

• Bachelor’s degree with 1+ years of relevant industry experience
• Master’s degree in related discipline
• Experience applying SPC methodologies in manufacturing (preferred)
• Hands-on experience in Semiconductor Packaging or Packaging Substrate Manufacturing (preferred)

Responsibilities

• Provide hands-on, real-time floor support for equipment, processes, and product issues.
• Receive and deliver shift pass-downs; align priorities with management.
• Troubleshoot process issues, perform error recovery, and support tool enabling activities.
• Write/update specifications and RFCs to maintain current process records.
• Perform inspection and imaging on panels to collect development data.
• Communicate with Tool and Lot Owners to resolve issues.
• Perform ad-hoc duties as required by the factory area.

Skills

Problem solving

Communication

Adaptability

Initiative

Teamwork

Education

Bachelor’s degree in Materials/Mechanical/Chemical Engineering, Chemistry, Physics, or related

Master’s degree in Materials/Mechanical/Chemical Engineering, Chemistry, Physics, or related

Job description

Intel Corporation is one of the world’s leading semiconductor companies, dedicated to creating technology that changes the world. From powering the cloud to enabling AI, autonomous vehicles, and next-generation computing, Intel’s innovations touch nearly every aspect of modern life. With a culture built on curiosity, collaboration, and a relentless drive to push boundaries, Intel offers engineers the opportunity to do the most meaningful work of their careers. Intel’s Substrate Packaging Technology Development (SPTD) organization is on a mission to be the supplier of choice for leading-edge and affordable substrate packaging solutions. As a critical part of Intel’s advanced manufacturing ecosystem, the SPTD team is driving the future of semiconductor packaging — and we’re looking for talented engineers to help us get there. We are seeking a motivated and technically skilled Module Engineer On Shift (MEOS) to join our SPTD team at our state-of-the-art facility in Chandler, Arizona. In this role, you will be a critical part of our 24x7 manufacturing operation, providing real-time support to ensure seamless lot movement through the production line. You’ll work directly on the factory floor, solving complex equipment and process challenges, and collaborating with a talented team of engineers and technicians.

Shift 6 Details

• Hours: 6:00 PM — 6:00 AM (Night Shift)
• Schedule: Alternating Work Weeks: Alternating 3-Day Work Week (Wed, Thurs, Fri) and 4-Day Work Week (Wed, Thurs, Fri, Sat)
• This position is based in Arizona
• Compensation for this role will be determined in accordance with the applicable salary range for the Arizona work location, as well as factors such as skills, qualifications, and experience

Key Responsibilities

• Factory Floor Support: Provide hands-on, real-time support for equipment, process, and product issues to maintain continuous 24x7 lot movement through the manufacturing line
• Shift Communication: Receive written and verbal pass-downs from outgoing shift peers; deliver comprehensive, quality pass-downs to incoming shift teams; align priorities with management at the start of each shift
• Troubleshooting & Error Recovery: Respond promptly to process issues, perform error recovery, manage lot disposition, and support new tool enabling activities
• Documentation: Write and update specifications and RFCs (Request for Change) as required to maintain accurate and current process records
• Inspection & Imaging: Execute non-standard procedures and perform inspection and imaging on panels to collect critical development data
• Stakeholder Communication: Communicate effectively via email with Tool and Lot Owners regarding key issues, ensuring timely resolution and transparency
• Ad-Hoc Support: Perform a variety of ad-hoc duties as required by the factory within your specific functional area

You Will Bring

• Strong problem-solving instincts — you approach challenges with curiosity and persistence
• Clear and confident communication — you can articulate complex issues clearly to peers, engineers, and stakeholders
• Adaptability — you thrive in a dynamic environment and can pivot quickly when priorities shift
• Self-motivation and initiative — you take ownership of your work and don’t wait to be told what to do next
• Team-oriented mindset — you support your colleagues and contribute to a positive, collaborative shift culture

Qualifications

This is an entry level position. You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience. This Position is not eligible for Intel immigration sponsorship.

Minimum Qualifications

• Bachelor’s degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with 1+ years of relevant industry experience
• Master’s degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline

Preferred Qualifications

• 1+ years of experience: Applying Statistical Process Control (SPC) methodologies in a manufacturing environment
• Hands-on experience in Semiconductor Packaging or Packaging Substrate Manufacturing

Job Type: Experienced Hire

Shift: Shift 6 (United States of America)

Primary Location: US, Arizona, Phoenix

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $99,030.00-139,810.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Work Model for this Role

This role will require an on-site presence.

• Job posting details (such as work model, location or time type) are subject to change
• ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.