Module Engineer On-Shift (MEOS) – Night Shift (4)

Intel Corporation; Chandler (AZ); On-site; USD 85,000 - 140,000; Full time

Job summary

Intel Corporation's Substrate Packaging Technology Development (SPTD) is hiring a Module Engineer On Shift to join our Chandler, Arizona facility. You will work on the factory floor providing real-time support to maintain 24x7 lot movement and resolve equipment and process issues.

As part of a dynamic team, you will document changes, communicate with tool owners, and assist with tool enabling activities while operating on a night shift (6:00 PM–6:00 AM) on a rotating schedule.

Qualifications

• Requires a Bachelor's degree in materials/mechanical/chemical engineering, physics, or related field with 1+ year of experience.
• Master's degree in materials/mechanical/chemical engineering, physics, or related field.
• SPC experience in manufacturing is a plus.
• Hands-on experience in Semiconductor Packaging or Packaging Substrate Manufacturing preferred.

Responsibilities

• Provide real-time floor support for equipment, process, and product issues to maintain 24x7 flow.
• Receive pass-downs and deliver comprehensive handoffs to incoming shifts; align priorities with management.
• Troubleshoot issues, recover errors, manage lot disposition, and support tool enabling.
• Write and update specifications and RFCs to keep process records accurate.
• Perform inspection and imaging on panels to collect development data.
• Communicate with Tool and Lot Owners by email about key issues and resolutions.
• Carry out ad-hoc duties within the factory as needed.

Skills

Strong problem-solving

Clear communication

Adaptability

Self-motivation

Team-oriented

Education

Bachelor's degree in Materials/Mechanical/Chemical Eng, Physics or related field

Master's degree in Materials/Mechanical/Chemical Eng, Physics or related field

Job description

Intel Corporation is one of the world's leading semiconductor companies, dedicated to creating technology that changes the world. From powering the cloud to enabling AI, autonomous vehicles, and next-generation computing, Intel's innovations touch nearly every aspect of modern life. With a culture built on curiosity, collaboration, and a relentless drive to push boundaries, Intel offers engineers the opportunity to do the most meaningful work of their careers. Intel's Substrate Packaging Technology Development (SPTD) organization is on a mission to be the supplier of choice for leading-edge and affordable substrate packaging solutions. As a critical part of Intel's advanced manufacturing ecosystem, the SPTD team is driving the future of semiconductor packaging — and we're looking for talented engineers to help us get there. We are seeking a motivated and technically skilled Module Engineer On Shift (MEOS) to join our SPTD team at our state-of-the-art facility in Chandler, Arizona. In this role, you will be a critical part of our 24x7 manufacturing operation, providing real-time support to ensure seamless lot movement through the production line. You'll work directly on the factory floor, solving complex equipment and process challenges, and collaborating with a talented team of engineers and technicians.

Shift 4 Details

• Hours: 6:00 PM – 6:00 AM (Night Shift)
• Schedule: Alternating 3- and 4-day work weeks (Sunday–Tuesday, with alternating Saturdays) — giving you more days off than a traditional 5-day schedule!
• Location: Arizona

Key Responsibilities

• Factory Floor Support: Provide hands-on, real-time support for equipment, process, and product issues to maintain continuous 24x7 lot movement through the manufacturing line.
• Shift Communication: Receive written and verbal pass-downs from outgoing shift peers; deliver comprehensive, quality pass-downs to incoming shift teams; align priorities with management at the start of each shift.
• Troubleshooting & Error Recovery: Respond promptly to process issues, perform error recovery, manage lot disposition, and support new tool enabling activities.
• Documentation: Write and update specifications and RFCs (Request for Change) as required to maintain accurate and current process records.
• Inspection & Imaging: Execute non-standard procedures and perform inspection and imaging on panels to collect critical development data.
• Stakeholder Communication: Communicate effectively via email with Tool and Lot Owners regarding key issues, ensuring timely resolution and transparency.
• Ad-Hoc Support: Perform a variety of ad-hoc duties as required by the factory within your specific functional area.

As a Successful Candidate, You Will Bring

• Strong problem-solving instincts — you approach challenges with curiosity and persistence
• Clear and confident communication — you can articulate complex issues clearly to peers, engineers, and stakeholders
• Adaptability — you thrive in a dynamic environment and can pivot quickly when priorities shift
• Self-motivation and initiative — you take ownership of your work and don't wait to be told what to do next
• Team-oriented mindset — you support your colleagues and contribute to a positive, collaborative shift culture

Minimum Qualifications

• Bachelor's degree in materials engineering, mechanical engineering, chemical engineering, chemistry, physics, or a related discipline with 1+ years of relevant industry experience OR Master's degree in materials engineering, mechanical engineering, chemical engineering, chemistry, physics, or a related discipline

Preferred Qualifications

• 1+ years of experience: Applying Statistical Process Control (SPC) methodologies in a manufacturing environment
• Hands-on experience in Semiconductor Packaging or Packaging Substrate Manufacturing

Job Type: Experienced Hire Shift: Shift 4 (United States of America)

Primary Location: US, Arizona, Phoenix Additional Locations:

This Position is not eligible for Intel immigration sponsorship.

Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $85,200.00-139,810.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence.

* Job posting details (such as work model, location or time type) are subject to change.

* ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.