Module Engineer On-Shift (MEOS) – Day Shift (7)

Intel Corporation; Phoenix (AZ); On-site; USD 85,000 - 163,000; Full time

Benefits offered by this job

Health insurance

Retirement plan

Paid time off

Job summary

Intel Corporation in Chandler, AZ, is seeking a Module Engineer On Shift (MEOS) for Day Shift to support a 24x7 manufacturing line. You will troubleshoot, document, and coordinate with Tool and Lot Owners to maintain continuous flow and data integrity.

The role emphasizes problem solving, clear communication, and adaptability in a fast-paced semiconductor packaging environment with on-site work in Arizona.

Qualifications

• Bachelor’s or Master’s in a relevant engineering/physical science discipline with 2+ years of related experience.
• Experience with metrology, lithography, or laser tools is preferred.
• Experience in semiconductor packaging or substrate manufacturing is a plus.

Responsibilities

• Provide real-time floor support to maintain 24x7 lot movement on the line.
• Receive and deliver pass-downs; align priorities with shift leadership.
• Troubleshoot process issues and perform rapid error recovery.
• Document specifications and RFCs to keep process records current.
• Perform inspection/imaging on panels and collect development data.

Skills

Metrology Tools

Exposure Lithography Tools

Laser Tools

Statistical Process Control

Education

Bachelor’s degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or related discipline

Master’s degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or related discipline

Tools

Metrology Tools

Lithography Tools

Laser Tools

Job description

## Module Engineer On-Shift (MEOS) – Day Shift (7)Apply: US, Arizona, Phoenix: Full time: Posted Today: End Date: January 6, 2027 (30+ days left to apply): JR0287874# **Job Details:**## Job Description:Intel is one of the world's leading semiconductor companies, driving innovation that shapes the future of technology. Our Substrate Packaging Technology Development (SPTD) organization is at the forefront of advanced packaging solutions, with a mission to be the supplier of choice for leading-edge and affordable substrate packaging. At Intel, we believe in creating an inclusive, collaborative, and innovative workplace where every team member plays a vital role in changing the world through technology.We are looking for a motivated and detail-oriented **Module Engineer On Shift (MEOS)** to join our SPTD team in Chandler, Arizona. In this role, you will be a critical part of our 24x7 manufacturing operation, providing real-time factory support to ensure seamless lot movement through the production line. You will work in a dynamic, fast-paced environment where your problem-solving skills and engineering expertise will directly impact the quality and efficiency of our substrate packaging manufacturing processes.**Shift 7 Details:*** **Shift Hours:** 6:00 AM – 6:00 PM* **Schedule:** Alternating 3- and 4-day work weeks (Thursday through Saturday and alternating Wednesday)This position is based in Arizona. Compensation for this role will be determined in accordance with the applicable salary range for the Arizona work location, as well as factors such as skills, qualifications, and experience.**Key Responsibilities:*** **Factory Floor Support:** Provide hands-on, real-time support for equipment, process, and product issues to maintain continuous 24x7 lot movement through the manufacturing line.* **Shift Communication:** Receive written and verbal pass-downs from outgoing shift peers; deliver comprehensive, quality pass-downs to incoming shift teams; align priorities with management at the start of each shift.* **Troubleshooting & Error Recovery:** Respond promptly to process issues, perform error recovery, manage lot disposition, and support new tool enabling activities.* **Documentation:** Write and update specifications and RFCs (Request for Change) as required to maintain accurate and current process records.* **Inspection & Imaging:** Execute non-standard procedures and perform inspection and imaging on panels to collect critical development data.* **Stakeholder Communication:** Communicate effectively via email with Tool and Lot Owners regarding key issues, ensuring timely resolution and transparency.* **Ad-Hoc Support:** Perform a variety of ad-hoc duties as required by the factory within your specific functional area.**As a Successful Candidate, You Will Bring:*** **Strong Problem-Solving Skills** – You approach challenges with curiosity and a solutions-oriented mindset.* **Excellent Communication** – You communicate clearly and confidently, both verbally and in writing, with peers, engineers, and stakeholders.* **Adaptability** – You thrive in a fast-paced environment and can pivot quickly when priorities shift.* **Self-Motivation** – You are a self-starter who can manage your own workload while also contributing to team success.* **Collaborative Spirit** – You work well with others and understand the importance of teamwork in a manufacturing environment.* **Attention to Detail** – You take pride in accuracy and thoroughness in everything you do.If you are passionate about semiconductor technology and want to be part of a team that is shaping the future of advanced packaging, we want to hear from you!## **Qualifications:**You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience. This Position is not eligible for Intel immigration sponsorship. **Minimum Qualifications:*** Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with 2+ years of relevant experience* OR master’s degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline* Relevant experience will be any of the following: + Metrology Tools + Exposure Lithography tools + Laser Tools**Preferred Qualifications:*** 2+ years of experience in: + Statistical Process Control (SPC), Metrology tool recipe creation, and tool troubleshooting + Semiconductor Packaging or Packaging Substrate Manufacturing## Job Type:Experienced Hire## Shift:Shift 7 (United States of America)## Primary Location:US, Arizona, Phoenix## Additional Locations:## Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.## ## Position of TrustN/A## BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.Annual Salary Range for jobs which could be performed in the US: $85,200.00-162,500.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.**Work Model for this Role**This role will require an on-site presence. \\* Job posting details (such as work model, location or time type) are subject to change.