Advanced Packaging Lithography Manager – Strategy & Innovation

Intel; Hillsboro (OR); On-site; USD 155,520 - 298,440; Full time

Job summary

Intel Foundry is seeking an Advanced Packaging Lithography Module Development Manager to lead lithography development for next‑generation packaging solutions. This role will manage a team of process engineers while shaping patterning flow and process development for Foveros Direct technologies.

Based in Hillsboro, OR, this on‑site position offers the opportunity to influence Intel’s roadmap, partner with cross‑functional teams, and enable manufacturing excellence for next‑generation computing

Qualifications

• Master or PhD degree in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
• 6+ years of relevant experience with a master’s degree, or 5+ years of experience with a PhD degree.
• Equipment mastery: deep expertise with scanner/stepper systems (ASML, Canon, Nikon) and/or track equipment.
• Process development: extensive experience in lithography process optimization, yield enhancement, and manufacturing readiness.
• Project management experience, including developing schedules, tracking deliverables, and managing cross-functional collaborations.

Responsibilities

• Lead and manage a team of engineers, setting goals, evaluating performance, and coaching for innovation.
• Formulate long-term process roadmaps to keep Intel ahead in advanced packaging.
• Foster talent development within the etch team and drive technical excellence.
• Develop and execute project schedules, track milestones and cross‑functional feedback.
• Drive lithography module yield improvement and defect reduction initiatives.
• Partner with process integration and manufacturing operations to ensure seamless tech transfer.

Skills

Team leadership

Project management

DOE principles

Cross-functional collaboration

Process optimization

Education

Master or PhD in Physics or Engineering

Tools

Scanner/stepper systems (ASML, Canon, Nikon)

Track equipment

Job description

Intel Foundry is seeking an Advanced Packaging Lithography Module Development Manager to lead lithography development for next‑generation packaging solutions. This role will manage a team of process engineers while shaping patterning flow and process development for Foveros Direct technologies.

Based in Hillsboro, OR, this on‑site position offers the opportunity to influence Intel’s roadmap, partner with cross‑functional teams, and enable manufacturing excellence for next‑generation computing