WATD Module Development Engineer

Intel; Hillsboro (OR); On-site; USD 155,520 - 219,550; Full time

Job summary

Intel in Hillsboro, Oregon seeks a Module Development Engineer in the Wafer Assembly Technology Development Group (WATD) to drive innovation in advanced semiconductor packaging and enable high‑volume manufacturing.

You will lead design and optimization of manufacturing processes, work with cross‑functional teams, and apply SPC and data analytics to meet performance, yield and reliability goals in next‑generation devices.

Qualifications

• Development methodologies, statistical process control, and/or data analytics.
• Wafer-level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.

Responsibilities

• Drive technology development and enablement for both high‑volume manufacturing and future technologies.
• Lead design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
• Perform feasibility studies and pathfinding activities to meet device specifications via simulations and engineering methods.
• Develop and implement technology roadmaps to guide future manufacturing needs and industry standards.
• Collaborate with equipment and material suppliers to design and implement enabling process technologies.
• Modify operational equipment to improve efficiency, scalability, and production output.
• Apply statistical process control, data analytics, and machine learning to enhance process stability and continuous improvement.
• Optimize production efficiency, manufacturing techniques, and output for existing and new products.
• Partner with cross‑functional teams to ensure process integration and alignment with project deliverables.

Skills

Statistical process control

Data analytics

Wafer-level assembly

Semiconductor equipment

Advanced packaging

Process development

Education

Bachelor's degree in STEM (Materials Science, Mechanical, Chemical, Electrical, Physics)

Master's degree in STEM (same fields)

PhD in STEM (same fields)

Job description

Job Details

Job Description: Join the Wafer Assembly Technology Development Group (WATD) as a Module Development Engineer. You will drive innovation and excellence within Intel's advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting‑edge manufacturing processes, ensuring successful integration of advanced technologies. You will collaborate with cross‑functional teams and external partners to shape the technological roadmap, enabling next‑generation device architectures and reinforcing Intel's leadership in semiconductor innovation. Your work will directly impact Intel's ability to meet product performance, yield, and reliability standards while advancing high‑volume manufacturing capabilities.

Key Responsibilities

• Drive technology development and enablement for both high‑volume manufacturing and future technologies.
• Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
• Perform feasibility studies and pathfinding activities to meet desired device specifications through simulations and practical engineering methods.
• Develop and implement technology roadmaps to guide future manufacturing needs and industry standards.
• Collaborate with equipment and material suppliers to design and implement enabling process technologies.
• Recommend and execute modifications to operational equipment to improve efficiency, scalability, and production output.
• Employ statistical process control, data analytics, and machine learning techniques to enhance process stability and enable continuous improvement.
• Optimize production efficiency, manufacturing techniques, and output for existing and new products.
• Partner with cross‑functional teams to ensure process integration and alignment with project deliverables.

Qualifications

Minimum Qualifications

• Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 6+ years of relevant experience.
• OR Master's degree in the same fields with 4+ years of experience.
• OR PhD in the same fields with 2+ years of experience.

Experience listed above should be a combination of the following:

• Development methodologies, statistical process control, and/or data analytics.
• Wafer‑level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.

This position is not eligible for Intel Immigration Sponsorship.

Preferred Qualifications

• Experience in wafer‑level assembly, epoxy, mold materials, or related fields in advanced packaging.
• Demonstrated expertise in leading programs from early strategy formation through high‑volume production.
• Recognized technical leadership with a proven track record of solving complex engineering challenges.
• Experience with advanced packaging technologies such as hybrid bonded interconnects, RDL‑based packaging, or ultra‑fine pitch solder connections.
• Strong collaboration skills with internal and external teams, including yield, operations, and supplier management.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Oregon, Hillsboro

Additional Locations

None listed.

Business Group

Intel Foundry strives to make every facet of semiconductor manufacturing state‑of‑the‑art while delighting our customers—from delivering cutting‑edge silicon process and packaging technology leadership for the AI era to enabling our customers to design leadership products, global manufacturing scale, and supply chain. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement, and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembles/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Annual Salary Range for jobs which could be performed in the US: $155,520.00 - 219,550.00 USD. The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training.

Work Model for this Role

This role will require an on‑site presence. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.