Mechanical Thermal Engineer Packaging (Onsite)

Powerlattice Technologies Inc.; Vancouver (WA); On-site; USD 100,000 - 130,000; Full time

Benefits offered by this job

Stock options

Health, dental, vision, 401(k)

Job summary

Powerlattice Technologies Inc. is seeking a Mechanical Thermal Engineer to design and validate mechanical and thermal solutions for semiconductor packaging and AI computing platforms.

You will work with engineering teams to prototype, test, and release components that enable next‑gen chiplet technologies. The role requires 1–3 years of experience, hands‑on thermal design, and CAD expertise (SolidWorks/Creo).

Qualifications

• BS or MS in Mechanical Engineering or related field.
• 1–3 years of experience in thermal engineering or mechanical design.
• Understanding of thermal testing and heat transfer fundamentals.
• Experience with 3D CAD and GD&T principles.
• Familiarity with semiconductor packaging and hardware development is a plus.

Responsibilities

• Thermal engineering: design/test heatsinks, cold plates, and package hardware; analyze results and investigate failures.
• Mechanical engineering: create CAD models, drawings, and source components; perform tolerance analyses and GD&T.
• Collaborate with electronics hardware and packaging teams to define thermal/mechanical needs and maintain design records.

Skills

Thermal engineering

Mechanical design

3D CAD

GD&T

Data analysis

Communication

Team collaboration

Education

BS or MS in Mechanical Engineering

Tools

SolidWorks

Creo

FloEFD/Flotherm

ANYSYS Icepak

COMSOL

Job description

Powerlattice Technologies Inc. is seeking a Mechanical Thermal Engineer to design and validate mechanical and thermal solutions for semiconductor packaging and AI computing platforms.

You will work with engineering teams to prototype, test, and release components that enable next‑gen chiplet technologies. The role requires 1–3 years of experience, hands‑on thermal design, and CAD expertise (SolidWorks/Creo).