Thermal Engineer – Advanced Packaging & NPI

Advanced Micro Devices

Austin (TX)

On-site

USD 110,000 - 150,000

Full time

14 days+

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Job summary

Advanced Micro Devices is seeking a Thermal Engineer to drive thermal characterization and technology development for cutting-edge package architectures. You will collaborate with design, reliability, manufacturing, test, and product engineering to evaluate thermal performance and enable successful product ramps.

The role emphasizes hands-on problem solving, data analysis, and cross-functional collaboration to develop innovative thermal test methodologies and influence future packaging

Qualifications

  • Bachelor’s degree in Mechanical/thermal-related engineering required.
  • Experience in thermal engineering within semiconductor or advanced packaging.
  • Strong understanding of heat transfer and thermal management.
  • Experience with Thermal Test Vehicles (TTVs) and lab testing.
  • Ability to analyze data and correlate simulations with measurements.
  • Experience supporting NPI, qualification, OSAT engagements.

Responsibilities

  • Serve as the thermal SME for advanced packaging and NPI programs.
  • Lead thermal characterization, TTV development, testing, and data analysis.
  • Develop thermal models and correlate simulations with lab data.
  • Collaborate with cross-functional teams to assess thermal performance.
  • Support qualification, product bring-up, and OSAT manufacturing transfers.
  • Investigate thermal issues and drive root-cause corrective actions.
  • Contribute to future thermal tech pathfinding and process improvement.

Skills

Thermal engineering
Heat transfer
Data analysis
Troubleshooting
Cross-functional collaboration
Communication

Education

Bachelor’s degree in Mechanical Engineering
Bachelor’s degree in Thermal Engineering
Master’s degree preferred

Tools

Thermal test equipment

Job description

Advanced Micro Devices is seeking a Thermal Engineer to drive thermal characterization and technology development for cutting-edge package architectures. You will collaborate with design, reliability, manufacturing, test, and product engineering to evaluate thermal performance and enable successful product ramps.

The role emphasizes hands-on problem solving, data analysis, and cross-functional collaboration to develop innovative thermal test methodologies and influence future packaging

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