Thermal IC Packaging Engineer

Socket.dev; Cupertino (CA); On-site; USD 150,000 - 225,000; Full time

Benefits offered by this job

Medical and dental coverage

Apple stock programs

Tuition reimbursement

Job summary

APPLE INC is seeking a Master’s‑level Mechanical Engineer to architect advanced thermal solutions for cutting‑edge chips in Cupertino, CA. You will run CFD and heat transfer analyses, collaborating with silicon design, packaging teams, and validation engineers to optimize thermal performance across die and package levels.

Responsibilities include developing detailed thermal models, implementing conductive heat transfer simulations in C++/Python, and supporting cross‑functional design reviews.

Qualifications

• Master's Degree in Mechanical Engineering or foreign equivalent.
• Experience applying heat transfer principles to optimize packaging thermal design across silicon and system levels.
• Experience implementing conductive heat transfer models in Python/C++ and automating thermal simulations.

Responsibilities

• Architect thermal solutions to address chip energy efficiency and performance scaling.
• Run CFD and heat transfer analyses for mobile devices at silicon die and package levels.
• Collaborate with cross‑functional teams on silicon design, system thermal design, and debugging thermal issues.
• Develop and refine thermal models and validate them with simulation and measurement data.

Skills

C++

Python

CFD

Heat transfer

Thermal modeling

Two-phase heat transfer

CAD tools

Education

Master's Degree in Mechanical Engineering

Tools

CAD tools

CFD software

Job description

APPLE INC is seeking a Master’s‑level Mechanical Engineer to architect advanced thermal solutions for cutting‑edge chips in Cupertino, CA. You will run CFD and heat transfer analyses, collaborating with silicon design, packaging teams, and validation engineers to optimize thermal performance across die and package levels.

Responsibilities include developing detailed thermal models, implementing conductive heat transfer simulations in C++/Python, and supporting cross‑functional design reviews.