Mechanical Thermal Engineer

Powerlattice Technologies Inc.; Vancouver (WA); On-site; USD 100,000 - 130,000; Full time

Benefits offered by this job

Stock options

Health, dental, vision, 401(k)

Job summary

Powerlattice Technologies Inc. is seeking a Mechanical Thermal Engineer to design and validate mechanical and thermal solutions for semiconductor packaging and AI computing platforms.

You will work with engineering teams to prototype, test, and release components that enable next‑gen chiplet technologies. The role requires 1–3 years of experience, hands‑on thermal design, and CAD expertise (SolidWorks/Creo).

Qualifications

• BS or MS in Mechanical Engineering or related field.
• 1–3 years of experience in thermal engineering or mechanical design.
• Understanding of thermal testing and heat transfer fundamentals.
• Experience with 3D CAD and GD&T principles.
• Familiarity with semiconductor packaging and hardware development is a plus.

Responsibilities

• Thermal engineering: design/test heatsinks, cold plates, and package hardware; analyze results and investigate failures.
• Mechanical engineering: create CAD models, drawings, and source components; perform tolerance analyses and GD&T.
• Collaborate with electronics hardware and packaging teams to define thermal/mechanical needs and maintain design records.

Skills

Thermal engineering

Mechanical design

3D CAD

GD&T

Data analysis

Communication

Team collaboration

Education

BS or MS in Mechanical Engineering

Tools

SolidWorks

Creo

FloEFD/Flotherm

ANYSYS Icepak

COMSOL

Job description

Mechanical Thermal Engineer

Reports to: Sr Director Thermal Mechanical Engineering

About Us

Powerlattice is a well-funded semiconductor start-up company backed by leading Silicon Valley venture capital firms. We are developing groundbreaking chiplet power delivery technology that will transform how high-performance processors are powered, enabling the next generation of AI and advanced computing.

About the Role

We are seeking a motivated Mechanical Thermal Engineer with 1-3 years of experience to support the development of advanced mechanical and thermal solutions for semiconductor packaging and AI computing platforms. In this role, you will work closely with thermal, structural, package, reliability, and manufacturing engineers to design, prototype, test, and validate components that enable next-generation chiplet technologies.

This position offers an opportunity to gain hands‑on experience in thermal engineering, mechanical design, semiconductor packaging, and product development while contributing to innovative technologies for future AI infrastructure.

As a Mechanical Thermal Engineer, you will contribute to the development of mechanical and thermal solutions that improve product performance, reliability, and manufacturability. Your work will support engineering teams from concept development through prototype validation and product release.

Key Responsibilities

• Thermal Engineering: Support the design and test of heatsinks, cold plates, retention mechanisms, fixtures, mechanical supports, and package integration hardware. Execute laboratory testing, collect data, and document results, Analyze test results and support root‑cause investigations related to mechanical, thermal, or reliability performance. Perform basic thermal analyses under the guidance of senior engineers.

• Mechanical Engineering: Create and maintain detailed 3D CAD models, assemblies, and engineering drawings for mechanical and thermal components. Interface with suppliers and fabrication partners to support prototype builds and component sourcing. Conduct tolerance stack‑up analyses and support GD&T implementation for mechanical assemblies.

• Engineering: Partner with electronics hardware and semiconductor packaging and development teams to guide thermal and mechanical needs and design. Maintain engineering documentation, test reports, specifications, and design records.

Minimum Qualifications

• This is an onsite role requiring 5 days a week onsite at our HQ's in Vancouver, WA (Greater Portland Area)

• BS or MS in Mechanical Engineering or a related engineering discipline.

• 1-3 years of experience in thermal engineering or mechanical design, product development, or related engineering roles.

• Understanding thermal testing, heat transfer fundamentals and simulation tools such as FloEFD/Flotherm, ANSYS Icepak, Fluent, COMSOL, or equivalent.

• Understanding of mechanical engineering fundamentals including structural mechanics, materials, and manufacturing processes.

• Experience with 3D CAD software such as SolidWorks, Creo or similar platforms.

• Experience creating detailed engineering drawings and applying GD&T principles.

• Strong analytical, organizational, and problem‑solving skills.

• Effective written and verbal communication skills.

• Ability to work in a fast‑paced, collaborative engineering environment.

Preferred Qualifications

• Exposure to semiconductor packaging, electronics hardware, data center systems, and semiconductor packaging qualification testing

• Experience using simulation tools such as FloTherm/FloEFD, Abaqus, ANSYS Icepak/Mechanical, SolidWorks Simulation, or COMSOL.

• Familiarity with thermal interface materials, heatsinks, cold plates, and electronics cooling concepts.

• Experience supporting laboratory testing, instrumentation, and prototype validation activities.

• Familiarity with manufacturing methods such as CNC machining, sheet metal forming, plastic 3D printing and metal additive manufacturing

Compensation & Benefits

Anticipated annual base salary for Member of Technical Staff: $100,000 - $130,000

• Stock option grant

• Comprehensive benefits package including health, dental, vision, and 401(k