Lead Wafer-Level Molding & Underfill Engineer

Volantis Semiconductor, Inc.; Boston (MA); On-site; USD 120,000 - 170,000; Full time

Job summary

Volantis Semiconductor, Inc. is seeking a hands-on Process and Materials Engineer to own wafer level molding and underfill processes across development and manufacturing.

You will lead mold compound selection, MUF development, and cross-functional support to enable robust packaging from concept to high-volume production. The role requires deep know-how in molding technologies, capillary underfill, cure profiling, and reliability testing, with collaboration across design, reliability, thermal,

Qualifications

• Experience in wafer level molding and underfill for FOWLP/2.5D/3D packages.
• Knowledge of mold compound and underfill materials and cure kinetics.
• Experience with capillary underfill, flow, voids, and cure profiling.
• Ability to work with OSATs and material suppliers for qualification and transfer.
• Strong problem-solving and DOE-driven optimization.

Responsibilities

• Develop and optimize wafer level molding and MUF for advanced packages.
• Select and qualify mold compounds and underfill materials.
• Develop CUF dispense, flow, void optimization, and cure profiles.
• Assess assembly risks and define process windows for yield.
• Collaborate with OSATs and suppliers for qualification and transfers.
• Characterize material properties and relate to reliability.
• Model solder joint reliability and warpage with molds/underfills.
• Support reliability qualification including thermal cycling and power cycling.
• Work cross-functionally from concept to high-volume production.

Skills

Wafer molding

Underfill

Materials science

Failure analysis

DOE optimization

Cross-functional

Job description

Volantis Semiconductor, Inc. is seeking a hands-on Process and Materials Engineer to own wafer level molding and underfill processes across development and manufacturing.

You will lead mold compound selection, MUF development, and cross-functional support to enable robust packaging from concept to high-volume production. The role requires deep know-how in molding technologies, capillary underfill, cure profiling, and reliability testing, with collaboration across design, reliability, thermal,