Process Engineer II - Advanced Packaging & Lithography

Applied Materials, Inc.; Santa Clara (CA); On-site; USD 100,000 - 137,000; Full time

Job summary

Applied Materials, Inc. in Santa Clara, CA seeks a Process Engineer to design, optimize, and maintain lab-scale semiconductor processes for advanced packaging.

You will collect data, perform hardware characterization, and collaborate with customers and vendors to resolve issues. The role emphasizes hands-on experimentation within cross-functional teams to advance wafer-level packaging, flip-chip, and 3D integration.

Qualifications

• Hands-on semiconductor packaging and/or semiconductor fabrication experiences in academia and/or industry.
• Expertise on Lithography, Wet chemical etch/ clean, dry film lamination is preferrable.

Responsibilities

• Conduct lab-based experiments to evaluate and improve advanced packaging processes.
• Develop, optimize, and sustain photolithography processes for advanced packaging.
• Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines.
• Perform hardware characterization on a variety of difficult systems, within safety guidelines.
• Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues.
• Generate internal and external documentation for products, presentations and technical reports.
• Interact with customers to resolve a variety of difficult process engineering issues/problems with limited supervision.
• Measure film properties and interpret data.
• Identify, select and work with vendors and suppliers with limited supervision.
• Implement new technology, products and analytical instrumentation.

Skills

Semiconductor packaging

Data analysis

Lab experiments

Troubleshooting

Education

Bachelor's degree in engineering

Job description

Applied Materials, Inc. in Santa Clara, CA seeks a Process Engineer to design, optimize, and maintain lab-scale semiconductor processes for advanced packaging.

You will collect data, perform hardware characterization, and collaborate with customers and vendors to resolve issues. The role emphasizes hands-on experimentation within cross-functional teams to advance wafer-level packaging, flip-chip, and 3D integration.