Die-to-Wafer Hybrid Bonding Module Engineer

Applied Materials; Santa Clara (CA); On-site; USD 147,000 - 203,000; Full time

Benefits offered by this job

Relocation assistance

Bonus and stock award program

Stock option plan

Job summary

Applied Materials is seeking a Die-to-Wafer Hybrid Bonding Module Engineer to develop and scale next‑generation bonding technologies for AI accelerators, memory, and chiplets.

The role leads process module development, from die preparation and surface activation to hybrid bonding, post‑bond characterization, and manufacturing scale‑up, collaborating with equipment teams and R&D partners.

Qualifications

• Minimum 5+ years of semiconductor process development experience.
• Experience in hybrid bonding, wafer bonding, and advanced packaging.

Responsibilities

• Develop and optimize die-to-wafer (D2W) hybrid bonding processes for advanced packaging applications.
• Drive Cu‑Cu and dielectric‑dielectric interconnect formation with focus on electrical performance and reliability.
• Collaborate with integration teams to resolve process interactions and yield excursions.
• Lead cross‑functional projects from concept through technology transfer.

Skills

Hybrid bonding

Wafer bonding

HBM development

Advanced packaging

Die placement

Surface activation

Education

M.S. in Materials Science

M.S. in Electrical Engineering

M.S. in Mechanical Engineering

M.S. in Chemical Engineering

M.S. in Physics

Ph.D. in a related discipline

Tools

JMP/Minitab

DOE

Job description

Applied Materials is seeking a Die-to-Wafer Hybrid Bonding Module Engineer to develop and scale next‑generation bonding technologies for AI accelerators, memory, and chiplets.

The role leads process module development, from die preparation and surface activation to hybrid bonding, post‑bond characterization, and manufacturing scale‑up, collaborating with equipment teams and R&D partners.